Wenbo Ye;Junmin Zhou;Han Gao;Haowen Guo;Yitian Gu;Xinbo Zou
{"title":"1.48-dB-Noise Figure E-Mode Recessed-Gate GaN MOSHEMT by Argon-Based Neutral Beam Etching for LNA Applications","authors":"Wenbo Ye;Junmin Zhou;Han Gao;Haowen Guo;Yitian Gu;Xinbo Zou","doi":"10.1109/TED.2025.3534157","DOIUrl":null,"url":null,"abstract":"In this study, the device properties of gallium nitride (GaN) enhancement-mode (E-mode) recessed-gate high-electron-mobility transistor (HEMT) are thoroughly characterized and investigated for low-noise amplifier (LNA) applications. Through low-damage argon-based neutral beam etching (Ar-NBE) technology, the recessed-gate HEMT achieves a positive voltage threshold (<inline-formula> <tex-math>${V} _{\\text {TH}}$ </tex-math></inline-formula>) of 0.5 V, a maximum transconductance (gm) of 148 mS/mm, and an <sc>on</small>-state gate leakage current (<inline-formula> <tex-math>${I} _{\\text {G}}$ </tex-math></inline-formula>) of 2.39 nA/mm. The device reveals a 1.48-dB minimum noise figure (NFmin), a 14.43-dB associated gain (<inline-formula> <tex-math>${G} _{\\text {a}}$ </tex-math></inline-formula>), and a 40.2-<inline-formula> <tex-math>$\\Omega $ </tex-math></inline-formula> equivalent noise resistance (<inline-formula> <tex-math>${R} _{\\text {N}}$ </tex-math></inline-formula>), at a working frequency of 2 GHz. As the frequency increases to 3.5 GHz, the NFmin slightly increases to 1.95 dB. In addition, the device obtained a cutoff frequency (<inline-formula> <tex-math>${f} _{\\text {T}}$ </tex-math></inline-formula>/<inline-formula> <tex-math>${f} _{\\text {MAX}}$ </tex-math></inline-formula>) of 9.6/27.8 GHz and an input third-order interception point (IIP3) of 10.3 dBm at 2 GHz. This work provides a promising strategy for the implementation of high-performance E-mode LNAs.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 3","pages":"1035-1040"},"PeriodicalIF":2.9000,"publicationDate":"2025-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10871922/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, the device properties of gallium nitride (GaN) enhancement-mode (E-mode) recessed-gate high-electron-mobility transistor (HEMT) are thoroughly characterized and investigated for low-noise amplifier (LNA) applications. Through low-damage argon-based neutral beam etching (Ar-NBE) technology, the recessed-gate HEMT achieves a positive voltage threshold (${V} _{\text {TH}}$ ) of 0.5 V, a maximum transconductance (gm) of 148 mS/mm, and an on-state gate leakage current (${I} _{\text {G}}$ ) of 2.39 nA/mm. The device reveals a 1.48-dB minimum noise figure (NFmin), a 14.43-dB associated gain (${G} _{\text {a}}$ ), and a 40.2-$\Omega $ equivalent noise resistance (${R} _{\text {N}}$ ), at a working frequency of 2 GHz. As the frequency increases to 3.5 GHz, the NFmin slightly increases to 1.95 dB. In addition, the device obtained a cutoff frequency (${f} _{\text {T}}$ /${f} _{\text {MAX}}$ ) of 9.6/27.8 GHz and an input third-order interception point (IIP3) of 10.3 dBm at 2 GHz. This work provides a promising strategy for the implementation of high-performance E-mode LNAs.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.