1.48-dB-Noise Figure E-Mode Recessed-Gate GaN MOSHEMT by Argon-Based Neutral Beam Etching for LNA Applications

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-02-04 DOI:10.1109/TED.2025.3534157
Wenbo Ye;Junmin Zhou;Han Gao;Haowen Guo;Yitian Gu;Xinbo Zou
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Abstract

In this study, the device properties of gallium nitride (GaN) enhancement-mode (E-mode) recessed-gate high-electron-mobility transistor (HEMT) are thoroughly characterized and investigated for low-noise amplifier (LNA) applications. Through low-damage argon-based neutral beam etching (Ar-NBE) technology, the recessed-gate HEMT achieves a positive voltage threshold ( ${V} _{\text {TH}}$ ) of 0.5 V, a maximum transconductance (gm) of 148 mS/mm, and an on-state gate leakage current ( ${I} _{\text {G}}$ ) of 2.39 nA/mm. The device reveals a 1.48-dB minimum noise figure (NFmin), a 14.43-dB associated gain ( ${G} _{\text {a}}$ ), and a 40.2- $\Omega $ equivalent noise resistance ( ${R} _{\text {N}}$ ), at a working frequency of 2 GHz. As the frequency increases to 3.5 GHz, the NFmin slightly increases to 1.95 dB. In addition, the device obtained a cutoff frequency ( ${f} _{\text {T}}$ / ${f} _{\text {MAX}}$ ) of 9.6/27.8 GHz and an input third-order interception point (IIP3) of 10.3 dBm at 2 GHz. This work provides a promising strategy for the implementation of high-performance E-mode LNAs.
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基于氩基中性束刻蚀的LNA应用中的1.48 db噪声图e模嵌入式栅极GaN MOSHEMT
在这项研究中,氮化镓(GaN)增强模式(e模式)嵌入式栅极高电子迁移率晶体管(HEMT)的器件特性进行了深入的表征和研究,用于低噪声放大器(LNA)的应用。通过低损伤氩基中性束刻蚀(Ar-NBE)技术,嵌入式栅极HEMT的正电压阈值(${V} _{\text {TH}}$)为0.5 V,最大跨导(gm)为148 mS/mm,导通栅极漏电流(${I} _{\text {G}}$)为2.39 nA/mm。该器件在2 GHz的工作频率下显示了1.48 db的最小噪声系数(NFmin), 14.43 db的相关增益(${G} _{\text {a}}$)和40.2- $\Omega $等效噪声电阻(${R} _{\text {N}}$)。当频率增加到3.5 GHz时,NFmin略微增加到1.95 dB。此外,该器件获得了9.6/27.8 GHz的截止频率(${f} _{\text {T}}$ / ${f} _{\text {MAX}}$)和2ghz时10.3 dBm的输入三阶截获点(IIP3)。这项工作为实现高性能e模LNAs提供了一种有前途的策略。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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