Dispersion of the Multimode Circuit Designed for the Extended Interaction Devices

IF 3.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-02-06 DOI:10.1109/TED.2025.3532569
Zhiwei Chang;Zhong Cao;Wenli Shang;Guoxiang Shu;Yanyan Tian;Wenlong He
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Abstract

A newly proposed multimode circuit designed for extended interaction devices (EIDs) has demonstrated its ability to achieve multimode oscillation and multimode amplification in the millimeter-wave bands. Various distinctive features related to this multimode circuit, especially its discontinuous dispersion, have been observed. Herein, the dispersion characteristics of this multimode circuit are comprehensively studied. The dispersion is verified through theoretical analyses, simulation, and cold test; S-parameters, the “break” in the dispersion, and the high-order modes are analyzed. This study lays a scientific foundation for the multimode working mechanism and offers guidance for the optimal design of the multimode circuit. It can also be applied to the research of conventional extended interaction circuits and enlightens other potential multimode circuits designed for high-efficiency broadband electron beam-driven terahertz sources.
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用于扩展交互器件的多模电路色散
一种新提出的用于扩展交互器件(eid)的多模电路已经证明了其在毫米波频段内实现多模振荡和多模放大的能力。已经观察到与这种多模电路有关的各种独特特征,特别是它的不连续色散。本文对该多模电路的色散特性进行了全面的研究。通过理论分析、仿真和冷试验验证了色散特性;对s参数、色散中的“破缺”和高阶模进行了分析。该研究为多模工作机理的研究奠定了科学基础,并为多模电路的优化设计提供了指导。它也可应用于传统扩展相互作用电路的研究,并对其他设计高效宽带电子束驱动太赫兹源的潜在多模电路具有启发意义。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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