Impact of a Moderately Doped Contact Layer on Breakdown Voltage in AlGaN/GaN Gated-Anode Diodes for Microwave Rectification

IF 3.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-28 DOI:10.1109/TED.2025.3530870
Tomoya Watanabe;Hidemasa Takahashi;Ryutaro Makisako;Akio Wakejima;Yuji Ando;Jun Suda
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Abstract

We fabricated a gated-anode diode employing an AlGaN/GaN high electron mobility transistor (HEMT) to serve as a rectification device in a 5.8-GHz band microwave wireless power transmission (WPT) system. To enhance the breakdown voltage and enable the devices to handle high power, a moderately doped contact layer was proposed and its impact on device performance was comprehensively investigated. We confirmed that medium doping facilitated depletion, achieving high breakdown voltage even with a short gate-to-contact spacing. However, an increase in contact resistance and a consequent decrease in forward current were observed as adverse effects. By optimizing the doping concentration, we successfully enhanced the breakdown voltage while suppressing the current drop, achieving a high-power density of 7.0 W/mm.
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适度掺杂接触层对微波整流用AlGaN/GaN栅极二极管击穿电压的影响
我们采用AlGaN/GaN高电子迁移率晶体管(HEMT)制备了一种栅极二极管,用于5.8 ghz波段微波无线电力传输(WPT)系统的整流器件。为了提高击穿电压,使器件能够处理高功率,提出了适度掺杂的接触层,并全面研究了其对器件性能的影响。我们证实了介质掺杂促进了损耗,即使在极-触点间距很短的情况下也能获得高击穿电压。然而,观察到接触电阻的增加和随之而来的正向电流的减少是不利影响。通过优化掺杂浓度,我们成功地提高了击穿电压,同时抑制了电流下降,实现了7.0 W/mm的高功率密度。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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