Advancing Mid-Infrared Detection in Silicon-Based Schottky Photodetectors via Metal Film Morphology and Hot Carrier Effect

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-28 DOI:10.1109/TED.2025.3530863
Du-Ting Cheng;Ting-Kai Chang;Yao-Han Dong;Ching-Fuh Lin
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Abstract

This study explores methods to enhance the responsivity of silver/silicon Schottky diode-based photodetectors in the mid-infrared wavelength range. Traditional infrared photodetectors primarily use compound semiconductors, but their scarcity and high cost limit application areas. This research employs silicon as the main material to reduce processing costs and improve integration with integrated circuits (ICs). By forming a Schottky contact between the metal and silicon, this study utilizes the internal photoemission absorbance mechanism to effectively extend the detection range to infrared light with energy lower than the semiconductor bandgap. Additionally, by controlling the morphology of the metal thin film to induce stronger local surface plasmon resonance, the absorbance and responsivity of light are significantly enhanced. The results show that under a 3460-nm infrared light source, the responsivity increased from 0.4154 to $3.8615~\mu $ A/W, nearly a tenfold improvement. Furthermore, through the study of hot carrier generation and diffusion, the responsivity of the device in the mid-infrared wavelength range was further enhanced, reaching $11.0964~\mu $ A/W. Moreover, the device could measure signals at wavelengths up to 6000 nm, surpassing the cutoff wavelength limitation. This demonstrates that the methods used in this study can effectively improve the performance of silicon-based Schottky detectors.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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