Performance of LIF neuron circuit based on threshold switching memristors

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-03-06 DOI:10.1016/j.mssp.2025.109428
Le An , Ting Jiang , Huaxian Liang , Yu Wang , Yichuan Zhang , Fanlin Long , Ningyang Liu , Zhaohui Zeng , Baolin Zhang
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Abstract

Building physical systems that mimic biological functions is crucial for enhancing the efficiency and scalability of neuromorphic computing. The Leaky Integrate-and-Fire (LIF) neuron model has gained attention owing to its simple architecture, low power consumption, high temporal resolution, and real-time processing. In this study, the spiking behaviors of LIF neuron circuits based on two types of threshold switching memristor devices (TSM)—Pt/Al2O3/HfO2/Ag (5 nm)/Pt and Pt/Al2O3/HfO2/Ag-NIs(5 nm)/Pt—were systematically investigated and compared under various voltage inputs and circuit elements. Simulations were also performed to explain the patterns of spiking behaviors observed in the experiments. The LIF neuron circuit based on the TSM device embedded with Ag nano-islands (Ag-NIs) demonstrates unique spike response characteristics in contrast to those without Ag-NIs. Specifically, the spike amplitude increases with increasing input voltage amplitude while the output spike frequency remains stable. This study highlights the significant influence of TSM materials on the performance of LIF neuron circuits and paves the way for the design of more efficient and reliable neuromorphic computing architectures.
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基于阈值开关忆阻器的LIF神经元电路性能
构建模拟生物功能的物理系统对于提高神经形态计算的效率和可扩展性至关重要。Leaky Integrate-and-Fire (LIF)神经元模型因其结构简单、功耗低、时间分辨率高、处理实时等优点而备受关注。在本研究中,系统研究了基于两种阈值开关忆阻器(TSM) -Pt /Al2O3/HfO2/Ag (5 nm)/Pt和Pt/Al2O3/HfO2/Ag- nis (5 nm)/Pt的LIF神经元电路在不同电压输入和电路元件下的尖峰行为,并进行了比较。还进行了模拟来解释实验中观察到的尖峰行为模式。基于嵌入银纳米岛(Ag- nis)的TSM器件的LIF神经元电路与未嵌入银纳米岛的TSM器件相比,具有独特的尖峰响应特性。具体来说,尖峰幅值随输入电压幅值的增加而增加,而输出尖峰频率保持稳定。本研究强调了TSM材料对LIF神经元电路性能的显著影响,为设计更高效、更可靠的神经形态计算架构铺平了道路。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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