Le An , Ting Jiang , Huaxian Liang , Yu Wang , Yichuan Zhang , Fanlin Long , Ningyang Liu , Zhaohui Zeng , Baolin Zhang
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引用次数: 0
Abstract
Building physical systems that mimic biological functions is crucial for enhancing the efficiency and scalability of neuromorphic computing. The Leaky Integrate-and-Fire (LIF) neuron model has gained attention owing to its simple architecture, low power consumption, high temporal resolution, and real-time processing. In this study, the spiking behaviors of LIF neuron circuits based on two types of threshold switching memristor devices (TSM)—Pt/Al2O3/HfO2/Ag (5 nm)/Pt and Pt/Al2O3/HfO2/Ag-NIs(5 nm)/Pt—were systematically investigated and compared under various voltage inputs and circuit elements. Simulations were also performed to explain the patterns of spiking behaviors observed in the experiments. The LIF neuron circuit based on the TSM device embedded with Ag nano-islands (Ag-NIs) demonstrates unique spike response characteristics in contrast to those without Ag-NIs. Specifically, the spike amplitude increases with increasing input voltage amplitude while the output spike frequency remains stable. This study highlights the significant influence of TSM materials on the performance of LIF neuron circuits and paves the way for the design of more efficient and reliable neuromorphic computing architectures.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.