In-situ DIC characterization of dislocation density and stored strain energy fields for deformation zones during cutting of Ti6Al4V alloy

IF 5.6 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY Measurement Pub Date : 2025-03-04 DOI:10.1016/j.measurement.2025.117197
Kai Ma , Zhanqiang Liu , Yukui Cai , Bing Wang
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Abstract

Cutting deformation behaviors at the microscale are important evidence for understanding fundamental cutting mechanisms. However, characterizing the microstructure of materials during the high-speed cutting process within narrow deformation zones presents significant challenges. In this work, a characterization methodology based on the digital image correlation (DIC) technique was developed to determine the microstructure evolution within the cutting deformation zones. High-speed in-situ visible and infrared image acquisition systems were utilized to capture gray and infrared image sequences during orthogonal cutting of Ti6Al4V. A deformation field reconstruction method based on the dislocation-density based (DDB) model was developed to derive the total dislocation density fields. The stored strain energy fields were then determined based on dislocation density fields. The generation process of serrated chips was investigated from macroscopic and microscopic perspectives to reveal the material removal mechanism during machining. This work provides a novel characterization methodology for investigating microstructure evolution under dynamic deformation conditions.

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Ti6Al4V合金切削变形区位错密度和存储应变能场的原位DIC表征
微观尺度下的切削变形行为是理解切削基本机理的重要依据。然而,表征材料在窄变形区高速切削过程中的微观组织是一个重大挑战。在这项工作中,开发了一种基于数字图像相关(DIC)技术的表征方法来确定切削变形区内的微观结构演变。采用高速原位可见光和红外图像采集系统对Ti6Al4V正交切割过程中的灰度和红外图像序列进行采集。提出了一种基于位错密度(DDB)模型的变形场重建方法,导出了总位错密度场。然后根据位错密度场确定了存储的应变能场。从宏观和微观两方面研究了锯齿形切屑的产生过程,揭示了加工过程中材料的去除机理。这项工作为研究动态变形条件下的微观结构演变提供了一种新的表征方法。
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来源期刊
Measurement
Measurement 工程技术-工程:综合
CiteScore
10.20
自引率
12.50%
发文量
1589
审稿时长
12.1 months
期刊介绍: Contributions are invited on novel achievements in all fields of measurement and instrumentation science and technology. Authors are encouraged to submit novel material, whose ultimate goal is an advancement in the state of the art of: measurement and metrology fundamentals, sensors, measurement instruments, measurement and estimation techniques, measurement data processing and fusion algorithms, evaluation procedures and methodologies for plants and industrial processes, performance analysis of systems, processes and algorithms, mathematical models for measurement-oriented purposes, distributed measurement systems in a connected world.
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