The Core–Shell Approach for Thermally Conductive and Electrically Insulating Polymer Nanocomposites: A Review

Abstract

The development of new high-performance materials in the field of polymer composites is becoming increasingly challenging as the requirements for real-life applications evolve rapidly. In particular, the issue of heat dissipation in a multitude of devices has become a matter of critical importance due to the ever-increasing compaction of electronic devices and the significant growth in power density stored in batteries. This calls for the development of novel solutions to enhance heat dissipation while preserving electrical insulation properties, particularly in light of safety concerns. In this context, polymer nanocomposites can play a significant role, as the incorporation of specific fillers can markedly improve their intrinsic properties, namely, low electrical conductivity, lightweightness, processability, and low cost. New fillers based on a core–shell structure have recently emerged. They are typically nanoscopic in size and synthesized through fine chemical processes to optimize their performance and ensure optimal cohesion with the polymer matrix. Nanocomposites based on core–shell nanofiller yield remarkable and highly promising outcomes, often exceeding the state of the art. This review article presents a comprehensive overview of these nanostructures and their applications, elucidating their significance and results, and discusses their role in achieving optimal heat dissipation.