Kinetic Investigation of CuSx Formation on Cu Substrates for Enhanced Electrochemical CO2 Reduction to HCOOH

IF 2.1 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Electronic Materials Letters Pub Date : 2025-02-13 DOI:10.1007/s13391-025-00546-y

Jin Wook Lim, Won Seok Cho, Jong-Lam Lee

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Abstract

Copper sulfide (CuS_x) is an electrocatalyst which selectively converts CO₂ into HCOOH under harsh conditions. Here, we investigate the formation and kinetics of CuS_x nanostructures on various multi-metal substrates to understand their catalytic properties in sulfur-containing environments. Using a combination of morphological, structural, and electrochemical analyses, we elucidate the time-dependent growth behavior of CuS_x nanostructures with progressive void formation over time. Notably, we discover that CuS_x formation is accelerated on substrates with galvanic corrosion-promoting metals such as Ag and Au, leading to enhanced selectivity for HCOOH during CO₂ reduction. In contrast, coating Cu with corrosion-inhibiting metals like Sn, Ni, or In reduce HCOOH selectivity, highlighting the critical role of galvanic corrosion in the CuS_x formation mechanism and its kinetics. This study experimentally identifies the impact of galvanic corrosion on CuS_x formation mechanisms and offers insights for optimizing electrocatalytic systems.

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来源期刊

Electronic Materials Letters 工程技术-材料科学：综合

CiteScore

4.70

自引率

20.80%

发文量

审稿时长

2.3 months

期刊介绍： Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.