Effect of DC Stress on Low-Frequency Noise Characteristics of W-Doped In2O3 BEOL Transistors

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-28 DOI:10.1109/TED.2025.3532234
Omkar Phadke;Khandker Akif Aabrar;Gihun Choe;Yuan-Chun Luo;Sharadindu Gopal Kirtania;Asif Islam Khan;Suman Datta;Shimeng Yu
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Abstract

In this article, we perform the low-frequency noise (LFN) characterization of back-end-of-line (BEOL) compatible transistors. Specifically, the noise performance of oxide channel (W-doped In2O3, or IWO) transistors with a dielectric gate (IWOMOSFET) and ferroelectric gate (IWO FeFET) is studied and compared. The objective of this study is to understand the impact of a ferroelectric gate on the device reliability under dc stress. The normalized noise power spectral density ( ${S}_{I}/{I}_{D}^{\,{2}}$ ) value is extracted for a fresh device and stressed device. We find that a ferroelectric gate-stack induces $3\times $ more noise than a dielectric gate-stack. Further, the increase in post stress ${S}_{I}/{I}_{D}^{\,{2}}$ for IWO FeFET is $7.5\times $ higher than that for IWO MOSFET under positive stress voltage, and negligible for both devices under negative stress voltage. We conclude that the stress induced by the same gate voltage in IWO FeFET is higher than that in IWO MOSFET is due to the electric field enhancement caused by polarization in the ferroelectric gate-stack, which leads to more defect generation under the stress.
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直流应力对w掺杂In2O3 BEOL晶体管低频噪声特性的影响
在这篇文章中,我们执行低频噪声(LFN)表征后端线(BEOL)兼容晶体管。具体而言,研究并比较了介质栅极(IWOMOSFET)和铁电栅极(IWO ffet)的氧化物通道(w掺杂In2O3,或IWO)晶体管的噪声性能。本研究的目的是了解在直流应力下铁电栅对器件可靠性的影响。提取新设备和应力设备的归一化噪声功率谱密度(${S}_{I}/{I}_{D}^{\,{2}}$)值。我们发现铁电栅极堆产生的噪声是介电栅极堆的3倍。此外,在正应力电压下,IWO ffet的后应力增量${S}_{I}/{I}_{D}^{\,{2}}$是IWO MOSFET的7.5倍,而在负应力电压下,这两种器件的后应力增量都可以忽略不计。结果表明,相同栅极电压下IWO ffet的应力比IWO MOSFET的应力大,这是由于铁电栅极堆极化引起的电场增强,导致在应力作用下产生更多的缺陷。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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