Juan Peng, Qiuxia Peng, Li Fan, Xian Li, Jiajun Ma and Junxiao Yang
{"title":"Low-dielectric benzocyclobutenyl polysiloxane resin: spatial structure design and photosensitive patterning performance†","authors":"Juan Peng, Qiuxia Peng, Li Fan, Xian Li, Jiajun Ma and Junxiao Yang","doi":"10.1039/D4RA08985E","DOIUrl":null,"url":null,"abstract":"<p >With the development of miniaturization and the high integration of semiconductor devices, higher performance requirements are put forward for polymer photoresists. In this paper, a benzocyclobutene-based polysiloxane photosensitive resin was prepared by sol–gel method, which was well patterned and cured quickly after UV light curing, with a minimum line width and line spacing of 10 μm. The benign combination of benzocyclobutene group (BCB) and polysiloxane in the resin makes the resin exhibit good low dielectric properties (<em>k</em> = 2.79) and excellent thermal properties and mechanical properties, which is different from traditional thermosetting resins.</p>","PeriodicalId":102,"journal":{"name":"RSC Advances","volume":" 10","pages":" 7956-7961"},"PeriodicalIF":3.9000,"publicationDate":"2025-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://pubs.rsc.org/en/content/articlepdf/2025/ra/d4ra08985e?page=search","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"RSC Advances","FirstCategoryId":"92","ListUrlMain":"https://pubs.rsc.org/en/content/articlelanding/2025/ra/d4ra08985e","RegionNum":3,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
With the development of miniaturization and the high integration of semiconductor devices, higher performance requirements are put forward for polymer photoresists. In this paper, a benzocyclobutene-based polysiloxane photosensitive resin was prepared by sol–gel method, which was well patterned and cured quickly after UV light curing, with a minimum line width and line spacing of 10 μm. The benign combination of benzocyclobutene group (BCB) and polysiloxane in the resin makes the resin exhibit good low dielectric properties (k = 2.79) and excellent thermal properties and mechanical properties, which is different from traditional thermosetting resins.
期刊介绍:
An international, peer-reviewed journal covering all of the chemical sciences, including multidisciplinary and emerging areas. RSC Advances is a gold open access journal allowing researchers free access to research articles, and offering an affordable open access publishing option for authors around the world.