Effect of Zn Addition on NbSn Layer Formation in the Nb/Cu-Sn-Ti Diffusion Reaction

IF 1.8 3区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Applied Superconductivity Pub Date : 2025-02-06 DOI:10.1109/TASC.2025.3539271
Koki Asai;Tsuyoshi Yagai;Taku Moronaga;Nobuya Banno
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Abstract

Enhancing the characteristics of Nb3Sn superconducting wire is essential for the development of magnets for fusion reactors like ITER and DEMO. It has been established that Ti-doping has a significant effect on enhancing the upper critical magnetic field (Bc2). Ti is generally doped into Nb or Sn-alloys in practical Nb3Sn superconducting wires, and it would be preferable to add Ti to the Sn side from a manufacturing perspective. However, Ti-doping on Sn sites could form some undesirable stable compounds layers at the interface with Nb as a diffusion barrier for Sn during the Nb3Sn layer formation. It is challenging to find a new reaction route that destabilizes these compound layers in the Nb3Sn formation process, which is expected to cause a dramatic improvement in Sn diffusion when Ti is doped to the Sn core. Nevertheless, there are few studies that fundamentally investigate this aspect. Studies have reported that Zn is effective for promoting Nb3Sn layer formations. Therefore, in this study, specific diffusion couples of Nb/Cu/Sn were fabricated with different combinations of Ti and Zn doping to Cu and Sn and their diffusion reaction behaviors in Nb3Sn layer formation were investigated. Besides, anticipating a potential grain refinement effect, an Mg and Zn co-doped sample was additionally fabricated. However, the grain refinement by Mg was not seen in the present wire configuration. The effect of Zn addition on promoting the Nb3Sn layer formation appeared at 650 °C/150 h HT, while it was not visible well at 685 °C/100 h HT.
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添加Zn对Nb/Cu-Sn-Ti扩散反应中NbSn层形成的影响
提高Nb3Sn超导导线的性能对ITER和DEMO等聚变反应堆磁体的发展至关重要。结果表明,ti掺杂对提高上临界磁场(Bc2)有显著作用。在实际的Nb3Sn超导导线中,Ti通常被掺杂到Nb或Sn合金中,从制造的角度来看,在Sn侧添加Ti更可取。然而,在Nb3Sn层形成过程中,在Sn位上掺杂ti会在界面处形成一些不理想的稳定化合物层,而Nb作为Sn的扩散屏障。在Nb3Sn形成过程中,寻找一种新的反应途径来破坏这些化合物层的稳定性是具有挑战性的,当Ti掺杂到Sn核中时,有望显著改善Sn的扩散。然而,很少有研究从根本上探讨这方面。已有研究报道Zn对Nb3Sn层的形成有促进作用。因此,本研究通过Ti和Zn掺杂Cu和Sn的不同组合制备了Nb/Cu/Sn的特定扩散偶,并研究了它们在Nb3Sn层形成中的扩散反应行为。此外,考虑到潜在的晶粒细化效果,还制备了Mg和Zn共掺杂样品。然而,在目前的线材结构中没有看到Mg的晶粒细化。在650°C/150 h高温下,Zn对Nb3Sn层的形成有促进作用,而在685°C/100 h高温下则不明显。
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来源期刊
IEEE Transactions on Applied Superconductivity
IEEE Transactions on Applied Superconductivity 工程技术-工程:电子与电气
CiteScore
3.50
自引率
33.30%
发文量
650
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Applied Superconductivity (TAS) contains articles on the applications of superconductivity and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Large scale applications include magnets for power applications such as motors and generators, for magnetic resonance, for accelerators, and cable applications such as power transmission.
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Low-AC-Loss Nb3Sn Validation Model Coil in Solid Nitrogen for a Fast-Switching-Field MRI Magnet Prototype. Cooldown and Ramp Test of a Low-Cryogen, Lightweight, Head-Only 7T MRI Magnet. Front Cover Table of Contents IEEE Transactions on Applied Superconductivity Publication Information
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