On-chip spectral imaging and sensing transition towards marketable technologies

Kaiyu Cui, Yidong Huang
{"title":"On-chip spectral imaging and sensing transition towards marketable technologies","authors":"Kaiyu Cui, Yidong Huang","doi":"10.1038/s44287-025-00148-8","DOIUrl":null,"url":null,"abstract":"The shift from lab research to real-world production of scientific innovations comes with challenges. For spectral imaging chips, we address practical application needs by identifying real problems, solving them efficiently and delivering functional solutions. This has enabled a substantial transition from academic research to market-ready products.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 3","pages":"151-152"},"PeriodicalIF":0.0000,"publicationDate":"2025-02-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-025-00148-8","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The shift from lab research to real-world production of scientific innovations comes with challenges. For spectral imaging chips, we address practical application needs by identifying real problems, solving them efficiently and delivering functional solutions. This has enabled a substantial transition from academic research to market-ready products.
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片上光谱成像和传感技术向市场化技术过渡
从实验室研究到科学创新的现实生产的转变伴随着挑战。对于光谱成像芯片,我们通过识别实际问题,有效解决问题并提供功能解决方案来满足实际应用需求。这使得从学术研究到市场就绪产品的重大转变成为可能。
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