Boron nitride for applications in microelectronics

Szu-Hua Chen, Blanka Magyari-Kope, Chuang-Han Hsu, Wei-Yen Woon, Szuya Sandy Liao
{"title":"Boron nitride for applications in microelectronics","authors":"Szu-Hua Chen, Blanka Magyari-Kope, Chuang-Han Hsu, Wei-Yen Woon, Szuya Sandy Liao","doi":"10.1038/s44287-025-00141-1","DOIUrl":null,"url":null,"abstract":"In this Perspective, we survey recent research on boron nitride (BN) including synthesis, integration and simulation aspects from the material engineering perspective for applications in microelectronics industry. First, we discuss the BN history and its process development milestones, with an emphasis on amorphous BN and hexagonal BN deposition process, highlighting the need for deep understanding of precursor and surface chemistry as well as integration issues. Next, we summarize recent material synthesis simulation progress for BN in the context of tackling complex amorphous material network formation mechanisms and discuss new methodology development needs to address current challenges. We propose future research directions towards the co-development between experimental and modelling approaches to further accelerate discovery of additional material property improvements. Finally, overall trends in microelectronic applications of BN and perspectives are presented and categorized into two main directions. This Perspective provides an overview of boron nitride research from the perspective of its synthesis, integration and simulation from the material engineering aspects to applications in microelectronics industry.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 3","pages":"205-214"},"PeriodicalIF":0.0000,"publicationDate":"2025-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s44287-025-00141-1.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-025-00141-1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this Perspective, we survey recent research on boron nitride (BN) including synthesis, integration and simulation aspects from the material engineering perspective for applications in microelectronics industry. First, we discuss the BN history and its process development milestones, with an emphasis on amorphous BN and hexagonal BN deposition process, highlighting the need for deep understanding of precursor and surface chemistry as well as integration issues. Next, we summarize recent material synthesis simulation progress for BN in the context of tackling complex amorphous material network formation mechanisms and discuss new methodology development needs to address current challenges. We propose future research directions towards the co-development between experimental and modelling approaches to further accelerate discovery of additional material property improvements. Finally, overall trends in microelectronic applications of BN and perspectives are presented and categorized into two main directions. This Perspective provides an overview of boron nitride research from the perspective of its synthesis, integration and simulation from the material engineering aspects to applications in microelectronics industry.

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