Manipulation Skill Representation and Knowledge Reasoning for 3C Assembly

IF 7.3 1区 工程技术 Q1 AUTOMATION & CONTROL SYSTEMS IEEE/ASME Transactions on Mechatronics Pub Date : 2025-03-17 DOI:10.1109/TMECH.2025.3543739
Fuchun Sun;Shengyi Miao;Daming Zhong;Lianghong Wu;Huaidong Zhou;Na Wang;Zhenkun Wen;Haiming Huang
{"title":"Manipulation Skill Representation and Knowledge Reasoning for 3C Assembly","authors":"Fuchun Sun;Shengyi Miao;Daming Zhong;Lianghong Wu;Huaidong Zhou;Na Wang;Zhenkun Wen;Haiming Huang","doi":"10.1109/TMECH.2025.3543739","DOIUrl":null,"url":null,"abstract":"Traditional manufacturing in the computer, communication, and consumer electronics (3C) industries primarily relies on automation but lacks autonomous learning, decision-making, and adaptability. To address this challenge, this study introduces a multi-layer multi-level knowledge representation (MLMLKR) approach aimed at enhancing the adaptability and accuracy of assembly processes in 3C tasks. The MLMLKR framework comprises five layers: task, area, object, action, and agent, as well as three levels: ontology, template, and instance. In addition, we have developed a comprehensive set of templates, including master templates, task subtemplates, and action subtemplates, to improve the transferability of robotic operations in 3C scenarios. To realize knowledge-enhanced task-to-action reasoning (KET2A), we utilize the learnable composite loss function to combine BERT module, graph attention network module and Seq2Seq module into a unified end-to-end model. Finally, we employ multilayer multi-level knowledge graph and KET2A into multiple assembly scenarios, further validate the capabilities of task transfer and action transfer. The experiment results demonstrated that the action sequence reasoning accuracy reached to 98.1% and the perplexity was 1.019. The reasoned sequence execution of subscriber identity module and memory module assembly tasks were performed in real scenarios. Furthermore, the proposed scheme accomplished congeneric object operating transfer from DDR3 8 G 138 × 38.8 mm to double data rate 3 (DDR3) 4 G 138 × 18.8 mm in memory module assembly task, also from Intel Core CPU to advanced micro devices (AMD) CPU in CPU assembly task. Meanwhile, it implemented congeneric action “press” operating transfer between CPU, memory module, and front camera assembly tasks. In a word, the proposed manipulation skill representation and knowledge reasoning method is feasible and can be applied in intelligent 3C assembly.","PeriodicalId":13372,"journal":{"name":"IEEE/ASME Transactions on Mechatronics","volume":"30 6","pages":"5387-5397"},"PeriodicalIF":7.3000,"publicationDate":"2025-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/ASME Transactions on Mechatronics","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10930311/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
引用次数: 0

Abstract

Traditional manufacturing in the computer, communication, and consumer electronics (3C) industries primarily relies on automation but lacks autonomous learning, decision-making, and adaptability. To address this challenge, this study introduces a multi-layer multi-level knowledge representation (MLMLKR) approach aimed at enhancing the adaptability and accuracy of assembly processes in 3C tasks. The MLMLKR framework comprises five layers: task, area, object, action, and agent, as well as three levels: ontology, template, and instance. In addition, we have developed a comprehensive set of templates, including master templates, task subtemplates, and action subtemplates, to improve the transferability of robotic operations in 3C scenarios. To realize knowledge-enhanced task-to-action reasoning (KET2A), we utilize the learnable composite loss function to combine BERT module, graph attention network module and Seq2Seq module into a unified end-to-end model. Finally, we employ multilayer multi-level knowledge graph and KET2A into multiple assembly scenarios, further validate the capabilities of task transfer and action transfer. The experiment results demonstrated that the action sequence reasoning accuracy reached to 98.1% and the perplexity was 1.019. The reasoned sequence execution of subscriber identity module and memory module assembly tasks were performed in real scenarios. Furthermore, the proposed scheme accomplished congeneric object operating transfer from DDR3 8 G 138 × 38.8 mm to double data rate 3 (DDR3) 4 G 138 × 18.8 mm in memory module assembly task, also from Intel Core CPU to advanced micro devices (AMD) CPU in CPU assembly task. Meanwhile, it implemented congeneric action “press” operating transfer between CPU, memory module, and front camera assembly tasks. In a word, the proposed manipulation skill representation and knowledge reasoning method is feasible and can be applied in intelligent 3C assembly.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
3C装配操作技能表示与知识推理
计算机、通信和消费电子(3C)行业的传统制造业主要依赖自动化,但缺乏自主学习、决策和适应性。为了解决这一挑战,本研究引入了一种多层多层次知识表示(MLMLKR)方法,旨在提高3C任务中装配过程的适应性和准确性。MLMLKR框架包括任务、区域、对象、动作和代理五层,本体、模板和实例三个层次。此外,我们还开发了一套全面的模板,包括主模板、任务子模板和动作子模板,以提高机器人操作在3C场景中的可移植性。为了实现知识增强的任务到行动推理(KET2A),我们利用可学习的复合损失函数将BERT模块、图注意网络模块和Seq2Seq模块组合成一个统一的端到端模型。最后,我们将多层多层次知识图谱和KET2A应用于多个装配场景,进一步验证了任务迁移和动作迁移的能力。实验结果表明,动作序列推理准确率达到98.1%,困惑度为1.019。用户身份模块和内存模块组装任务在实际场景中合理顺序执行。此外,该方案在内存模块组装任务中实现了从ddr38 8 G 138 × 38.8 mm到双数据速率3 (DDR3) 4 G 138 × 18.8 mm的同构对象操作传输,在CPU组装任务中实现了从Intel酷睿CPU到AMD CPU的同构对象操作传输。同时,实现了CPU、内存条、前置摄像头组装任务间的同质动作“按”操作传递。总之,所提出的操作技能表示和知识推理方法是可行的,可以应用于智能3C装配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE/ASME Transactions on Mechatronics
IEEE/ASME Transactions on Mechatronics 工程技术-工程:电子与电气
CiteScore
11.60
自引率
18.80%
发文量
527
审稿时长
7.8 months
期刊介绍: IEEE/ASME Transactions on Mechatronics publishes high quality technical papers on technological advances in mechatronics. A primary purpose of the IEEE/ASME Transactions on Mechatronics is to have an archival publication which encompasses both theory and practice. Papers published in the IEEE/ASME Transactions on Mechatronics disclose significant new knowledge needed to implement intelligent mechatronics systems, from analysis and design through simulation and hardware and software implementation. The Transactions also contains a letters section dedicated to rapid publication of short correspondence items concerning new research results.
期刊最新文献
Pump Flow Compensation and Variable-Gain Sliding Mode Control for Mitigating Temperature-Induced Degradation in Servo Pump-Controlled Systems Contrastive Feature Reasoning for EEG Classification in Asynchronous BCI-Controlled Humanoid Robot Integrated Stereo Vision and Compliance Control With an Underwater Manipulator for Hydraulic Structure Inspection and Maintenance IEEE/ASME Transactions on Mechatronics Publication Information Completely Split-KalmanNet: A Novel Hybrid Model-Based and Data-Driven Method for GNSS/IMU Integration
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1