Optimizing electronic component cooling with nanofluid jet flow in inverted T-shaped channel

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS Applied Thermal Engineering Pub Date : 2025-03-16 DOI:10.1016/j.applthermaleng.2025.126257
Soufiane Nouari , Mustapha AIT Hssain , Sara Armou , Benachir Boukhris , Rachid Mir
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Abstract

In this research paper, a numerical examination using the finite volume approach is performed on a model for Cu-Water nanofluid mixed convection in an inverted Τ-shaped channel with an impinging jet to cool electronic components. The agreement of the proposed model results with previous numerical work reported in the literature is verified. The impacts of various parameters including the Reynolds number (15 ≤ Re ≤ 200), dimension of heaters (0.05 ≤ S ≤ 0.5), and inter-heaters distance (0.1 ≤ D ≤ 2) on streamlines, isotherms, and Νusselt number are examined. Key findings reveal that flow circulation intensifies with a high Reynolds number and heater size, while recirculation zones vanish as the Reynolds number increases. The configuration of isotherms is highly responsive to changes in Reynolds number and heater size, with isothermal lines concentrating near heaters and curving at higher Reynolds numbers. The impinging jet ensures efficient heat exchange even at larger heater spacing, and the average Nusselt number reaches its peak value at high Reynolds numbers and heater sizes. Furthermore, the average Nusselt number is correlated as a function of the Reynolds number, the spacing distance between heaters, and their dimension to optimize and design such coolers used in electronic cooling.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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