Hierarchical-structured surface and corrosion behavior of Cu–Zr amorphous alloy manufactured by electrodeposition

IF 6.3 2区 材料科学 Q2 CHEMISTRY, PHYSICAL Surfaces and Interfaces Pub Date : 2025-04-01 Epub Date: 2025-03-15 DOI:10.1016/j.surfin.2025.106241
Yushun Wang , Wenjing Guo , Xuefeng Wei , Hang Yin , Jingyun Jiang , Shouren Zhang , Yannan Zhou
{"title":"Hierarchical-structured surface and corrosion behavior of Cu–Zr amorphous alloy manufactured by electrodeposition","authors":"Yushun Wang ,&nbsp;Wenjing Guo ,&nbsp;Xuefeng Wei ,&nbsp;Hang Yin ,&nbsp;Jingyun Jiang ,&nbsp;Shouren Zhang ,&nbsp;Yannan Zhou","doi":"10.1016/j.surfin.2025.106241","DOIUrl":null,"url":null,"abstract":"<div><div>Deep eutectic solvents (DESs) provide enormous opportunities for manufacturing functional, electronegative metal alloys with hierarchical structures—because of the broad working windows for electrochemical reactions and the advantages of multiscale directing chemistry. This work presents the electrodeposition preparation of a hierarchical-structured Cu–Zr amorphous alloy coating from ChCl–EG DES for the first time. The electrochemical behavior of Cu<sup>2+</sup> and Zr<sup>4+</sup>, and the comprehensive microscopic and structural characterizations of the obtained deposits, demonstrate a potential-dependent nucleation and growth mechanism of Cu and Zr species on the surface of Cu foil. The deposits yielded at the lower negative potentials containing small amounts of Zr (&lt; 4.0 at.%) are two-phase, with fibrous Cu<sub>a</sub>Zr<sub>b</sub>O<sub>c</sub> compounds cross-growing on the surface of the leaf-like face-centered cubic Cu phase. In contrast, the deposit obtained at a higher negative potential presents a Christmas tree-like Cu–Zr amorphous alloy structure (9.03 at.% Zr), and the hierarchical multiscale ZrO<sub>2</sub> amorphous layer formed on its surface can enable the native alloy with better corrosion resistance.</div></div>","PeriodicalId":22081,"journal":{"name":"Surfaces and Interfaces","volume":"62 ","pages":"Article 106241"},"PeriodicalIF":6.3000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surfaces and Interfaces","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2468023025005000","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/3/15 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0

Abstract

Deep eutectic solvents (DESs) provide enormous opportunities for manufacturing functional, electronegative metal alloys with hierarchical structures—because of the broad working windows for electrochemical reactions and the advantages of multiscale directing chemistry. This work presents the electrodeposition preparation of a hierarchical-structured Cu–Zr amorphous alloy coating from ChCl–EG DES for the first time. The electrochemical behavior of Cu2+ and Zr4+, and the comprehensive microscopic and structural characterizations of the obtained deposits, demonstrate a potential-dependent nucleation and growth mechanism of Cu and Zr species on the surface of Cu foil. The deposits yielded at the lower negative potentials containing small amounts of Zr (< 4.0 at.%) are two-phase, with fibrous CuaZrbOc compounds cross-growing on the surface of the leaf-like face-centered cubic Cu phase. In contrast, the deposit obtained at a higher negative potential presents a Christmas tree-like Cu–Zr amorphous alloy structure (9.03 at.% Zr), and the hierarchical multiscale ZrO2 amorphous layer formed on its surface can enable the native alloy with better corrosion resistance.

Abstract Image

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
电沉积Cu-Zr非晶合金的表面结构及腐蚀行为
深共晶溶剂(DESs)为制造具有层次结构的功能性、电负性金属合金提供了巨大的机会,因为它具有广泛的电化学反应工作窗口和多尺度定向化学的优势。本文首次提出了用ChCl-EG DES电沉积制备分层结构Cu-Zr非晶合金涂层的方法。Cu2+和Zr4+的电化学行为以及获得的镀层的综合微观和结构表征表明,Cu和Zr在Cu箔表面的成核和生长机制依赖于电位。在较低的负电位下产生的矿床含有少量的Zr (<;4.0 at.%)为两相,纤维状CuaZrbOc化合物在叶状面心立方Cu相表面交叉生长。相反,在较高负电位下获得的镀层呈现圣诞树状Cu-Zr非晶合金组织(9.03 at)。% Zr),在其表面形成分层多尺度ZrO2非晶层,使其具有更好的耐蚀性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Surfaces and Interfaces
Surfaces and Interfaces Chemistry-General Chemistry
CiteScore
8.50
自引率
6.50%
发文量
753
审稿时长
35 days
期刊介绍: The aim of the journal is to provide a respectful outlet for ''sound science'' papers in all research areas on surfaces and interfaces. We define sound science papers as papers that describe new and well-executed research, but that do not necessarily provide brand new insights or are merely a description of research results. Surfaces and Interfaces publishes research papers in all fields of surface science which may not always find the right home on first submission to our Elsevier sister journals (Applied Surface, Surface and Coatings Technology, Thin Solid Films)
期刊最新文献
Regulatory mechanisms of bias-induced texture changes in high-entropy nitride coatings and their effects on performance Surface synergy of nickel ammonium and polyethyleneimine for air-stable n-type SWCNT thermoelectric films PVP-modulated preparation of size-tunable Cu-MOF exhibiting good bactericidal effect and drug-release controlled behavior to efficiently kill tumor cell Construction of self-healing, superhydrophobic and fluorine-free supramolecular polymers on fly ash-based foamed ceramics Fabrication of high-efficiency, high weather-resistance, and superhydrophobic anti-reflective coatings for photovoltaic glass via ternary silane precursors synergy
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1