Hierarchical-structured surface and corrosion behavior of Cu–Zr amorphous alloy manufactured by electrodeposition

IF 5.7 2区 材料科学 Q2 CHEMISTRY, PHYSICAL Surfaces and Interfaces Pub Date : 2025-03-15 DOI:10.1016/j.surfin.2025.106241
Yushun Wang , Wenjing Guo , Xuefeng Wei , Hang Yin , Jingyun Jiang , Shouren Zhang , Yannan Zhou
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Abstract

Deep eutectic solvents (DESs) provide enormous opportunities for manufacturing functional, electronegative metal alloys with hierarchical structures—because of the broad working windows for electrochemical reactions and the advantages of multiscale directing chemistry. This work presents the electrodeposition preparation of a hierarchical-structured Cu–Zr amorphous alloy coating from ChCl–EG DES for the first time. The electrochemical behavior of Cu2+ and Zr4+, and the comprehensive microscopic and structural characterizations of the obtained deposits, demonstrate a potential-dependent nucleation and growth mechanism of Cu and Zr species on the surface of Cu foil. The deposits yielded at the lower negative potentials containing small amounts of Zr (< 4.0 at.%) are two-phase, with fibrous CuaZrbOc compounds cross-growing on the surface of the leaf-like face-centered cubic Cu phase. In contrast, the deposit obtained at a higher negative potential presents a Christmas tree-like Cu–Zr amorphous alloy structure (9.03 at.% Zr), and the hierarchical multiscale ZrO2 amorphous layer formed on its surface can enable the native alloy with better corrosion resistance.

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来源期刊
Surfaces and Interfaces
Surfaces and Interfaces Chemistry-General Chemistry
CiteScore
8.50
自引率
6.50%
发文量
753
审稿时长
35 days
期刊介绍: The aim of the journal is to provide a respectful outlet for ''sound science'' papers in all research areas on surfaces and interfaces. We define sound science papers as papers that describe new and well-executed research, but that do not necessarily provide brand new insights or are merely a description of research results. Surfaces and Interfaces publishes research papers in all fields of surface science which may not always find the right home on first submission to our Elsevier sister journals (Applied Surface, Surface and Coatings Technology, Thin Solid Films)
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