Processing effect on microstructures and flexural response of AlSi10Mg/AA 6061 multi-material fabricated by laser powder bed fusion

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2025-03-17 DOI:10.1016/j.matlet.2025.138417

Ibrahim H. ZainElabdeen , Wesley Cantwell , Rehan Umer , Kamran A. Khan

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Abstract

This study investigates the microstructure, tensile, and bending properties of AlSi10Mg/AA6061 bimetals fabricated via Laser Powder Bed Fusion (LPBF) in both butt and laminate configurations. Microstructural analysis reveals an interfacial zone, 40–100 μm thick, exhibiting strong metallurgical bonding facilitated by Marangoni convection and silicon diffusion. Tensile tests indicate ultimate tensile strengths (UTS) ranging from 307 to 314 MPa. Three-point bending tests highlight a configuration-dependent performance: laminated specimens with AA6061 under tension achieve exceptional bending strength (655 MPa, approximately 2 % higher than monolithic AlSi10Mg) and an elongation of 12.5 %, matching the ductility of AA6061. In contrast, butt joints exhibit minor strength reductions (596 MPa), due to small interfacial microcracks resulting from residual stresses. Digital image correlation confirms that strain localization patterns are governed by material modulus and hardening characteristics.

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激光粉末床熔接工艺对AlSi10Mg/AA 6061复合材料组织和弯曲响应的影响

研究了激光粉末床熔合（LPBF）制备的对接和层压板两种AlSi10Mg/AA6061双金属的微观结构、拉伸和弯曲性能。显微组织分析表明，界面区厚度为40 ~ 100 μm，表现出由Marangoni对流和硅扩散促进的强冶金结合。拉伸试验表明，极限拉伸强度（UTS）范围为307至314兆帕。三点弯曲测试强调了与结构相关的性能：AA6061层压试样在拉伸下获得了优异的抗弯强度（655 MPa，比单片AlSi10Mg高约2%）和12.5%的伸长率，与AA6061的延展性相匹配。相反，由于残余应力导致的界面微裂纹较小，对接接头的强度降低幅度较小（596 MPa）。数字图像相关性证实应变局部化模式受材料模量和硬化特性的支配。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive