Chunming Ai , Haichuan Lin , Pingping Sun , Xin Zhang
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Abstract
To achieve non-destructive testing using infrared thermal wave technology, we integrated heat transfer theory with image science, employing theoretical analysis, finite element numerical simulation, and infrared thermography experiments. Experiments were conducted at 80°C, 106°C, and 130°C, capturing surface temperature distributions. Analysis revealed temperature’s response to component thickness. COMSOL simulations matched experimental results, validating simulation feasibility and this lays the foundation for the subsequent promotion and application of this detection technology, significant for infrared applications in non-destructive testing.
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