Unexpected cellular growth of nanoporous gold during dealloying: Indication of vacancy injection?

IF 9.3 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Acta Materialia Pub Date : 2025-03-27 DOI:10.1016/j.actamat.2025.120959
Sheng-Nan Yang , Hui Xie , Fan Liu , Hai-Jun Jin
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Abstract

Dealloying can lead to stress corrosion cracking in engineering alloys or produce nanoporous materials for various functional applications. The role of bulk diffusion in dealloying has been debated since the 1960s when Pickering and Wagner proposed a vacancy-mediated lattice diffusion mechanism to explain the dealloying process. However, this mechanism was proven invalid because lattice diffusion is too slow to account for the rapid dealloying process at room temperature. Instead, it is now widely accepted that dealloying is dominated by the interfacial dissolution of more-reactive components, not necessarily involving lattice diffusion in the bulk. In this study, we report that the dealloying of Cu(Au) alloys at low potentials is incomplete, leaving some un-etched thin walls within the matrix of nanoporous gold. This results from the cellular growth of the nanoporous gold phase during dealloying, with cell walls composed of the precursor alloy phase slightly enriched with Au. This behavior is analogous to the cellular growth of solid phase during directional alloy solidification, suggesting that lattice diffusion may have occurred in the solid ahead of the dealloying front. Vacancy injection may lead to Au enrichment due to the inverse Kirkendall effect, enhancing the critical dealloying potential of the precursor ahead of the dealloying front, and triggering the unstable growth of the nanoporous gold phase. Although direct evidence is still lacking, our finding suggests that vacancy injection is involved in dealloying, which may have important implications on the design of corrosion-resistant alloys or novel nanoporous materials.

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纳米孔金在合金化过程中意外的细胞生长:空位注入的指示?
脱合金可以导致工程合金的应力腐蚀开裂或生产用于各种功能应用的纳米多孔材料。自20世纪60年代皮克林和瓦格纳提出空位介导的晶格扩散机制来解释脱合金过程以来,体扩散在脱合金过程中的作用一直存在争议。然而,这种机制被证明是无效的,因为晶格扩散太慢,无法解释室温下的快速脱合金过程。相反,现在广泛接受的是,合金的合金化主要是由反应性较强的组分的界面溶解主导,而不一定涉及体中的晶格扩散。在这项研究中,我们报告了Cu(Au)合金在低电位下的脱合金化是不完全的,在纳米多孔金的基体中留下了一些未蚀刻的薄壁。这是由于在脱合金过程中,纳米孔金相的细胞生长,由前驱体合金相组成的细胞壁中含有少量的Au。这种行为类似于定向合金凝固过程中固相的胞状生长,表明晶格扩散可能发生在合金化前沿的固体中。空位注入可能由于逆Kirkendall效应导致Au富集,使前驱体的临界脱溶电位提前提高,引发纳米孔金相的不稳定生长。虽然缺乏直接证据,但我们的发现表明,空位注入参与了合金化过程,这可能对耐腐蚀合金或新型纳米多孔材料的设计具有重要意义。
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来源期刊
Acta Materialia
Acta Materialia 工程技术-材料科学:综合
CiteScore
16.10
自引率
8.50%
发文量
801
审稿时长
53 days
期刊介绍: Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.
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