{"title":"Gr/HEA-FexNiCrCoCu interface getting excellent thermal transport","authors":"Yinjie Shen , Juan Guo , Yunqing Tang , Ping Yang","doi":"10.1016/j.intermet.2025.108756","DOIUrl":null,"url":null,"abstract":"<div><div>We try to excavate excellent thermal transport properties with the Gr/HEA-Fe<sub><em>x</em></sub>NiCrCoCu interface by manipulating Fe atom concentration percentages. The results show that the interfacial thermal conductivity (ITC) increases by 27.9 % when the loading temperature is from 300 K to 700 K, primarily due to the enhanced out-of-plane phonon coupling in the low-frequency region. In contrast, the Fe atom concentration exhibits a linear decrease with ITC, which can be attributed to the reduced phonon participation rate, the enhanced localization feature at the HEA edge, and the lattice distortion effect. This study better explains the thermal transport mechanism at the Gr-based HEA-Fe<sub><em>x</em></sub>NiCrCoCu heterogeneous interface and finds a highly efficient heat conduction interface for thermal rectifier devices in next-generation microelectronic devices.</div></div>","PeriodicalId":331,"journal":{"name":"Intermetallics","volume":"182 ","pages":"Article 108756"},"PeriodicalIF":4.8000,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Intermetallics","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0966979525001219","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
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Abstract
We try to excavate excellent thermal transport properties with the Gr/HEA-FexNiCrCoCu interface by manipulating Fe atom concentration percentages. The results show that the interfacial thermal conductivity (ITC) increases by 27.9 % when the loading temperature is from 300 K to 700 K, primarily due to the enhanced out-of-plane phonon coupling in the low-frequency region. In contrast, the Fe atom concentration exhibits a linear decrease with ITC, which can be attributed to the reduced phonon participation rate, the enhanced localization feature at the HEA edge, and the lattice distortion effect. This study better explains the thermal transport mechanism at the Gr-based HEA-FexNiCrCoCu heterogeneous interface and finds a highly efficient heat conduction interface for thermal rectifier devices in next-generation microelectronic devices.
期刊介绍：
This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys.
The journal reports the science and engineering of metallic materials in the following aspects:
Theories and experiments which address the relationship between property and structure in all length scales.
Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations.
Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties.
Technological applications resulting from the understanding of property-structure relationship in materials.
Novel and cutting-edge results warranting rapid communication.
The journal also publishes special issues on selected topics and overviews by invitation only.
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