Investigating Connectivity Deficits in Alzheimer's Disease Using a Novel 3D Bioprinted Model Designed to Quantify Neurite Outgrowth.

IF 3.7 3区 医学 Q2 ENGINEERING, BIOMEDICAL Bioengineering Pub Date : 2025-02-28 DOI:10.3390/bioengineering12030245
Chloe Whitehouse, Ellie Bravington, Anirudh Patir, Wei Wei, Janet Brownlees, Yufang He, Nicola Corbett
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Abstract

Here, we present a novel 3D bioprinted model of the forebrain cortex designed to quantify neurite outgrowth across a hydrogel bridge. To validate this model, we cultured Alzheimer's disease (AD) forebrain cortical populations derived from human iPSCs carrying APP (amyloid precursor protein) mutations (K670M/N671L + V717F). Neurite and synapse formation were significantly impaired in 3D AD mutant cultures compared to controls, but this was not replicated in 2D, highlighting deficits in these traditional 2D cell culture models. To investigate the mechanisms underlying impaired neurite outgrowth in 3D and 2D models of AD, we assessed amyloid-β dysfunction, mitochondrial health, and oxidative stress in both conditions. In the 3D model, APP mutant cultures exhibited reduced mitochondrial membrane potential and fragmented networks, indicating dysfunction and potential cellular energy deficits. Additionally, elevated oxidative stress and proteostasis disruption were identified in the 3D AD models as indicators of cellular damage, which may be limiting neurite extension. Furthermore, transcriptomic (bulk RNA-Seq) analysis revealed distinct differences in gene expression pathways between 2D and 3D models of AD, suggesting alternate underlying mechanisms of disease pathology between the culture conditions. This study demonstrates the functionality of this novel 3D bioprinted model for quantifying neurite connectivity and identifying underlying disease mechanisms.

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使用一种新的3D生物打印模型研究阿尔茨海默病的连通性缺陷,该模型旨在量化神经突的生长。
在这里,我们提出了一种新的前脑皮层3D生物打印模型,旨在量化通过水凝胶桥的神经突生长。为了验证这一模型,我们培养了来自携带APP(淀粉样蛋白前体蛋白)突变(K670M/N671L + V717F)的人类iPSCs的阿尔茨海默病(AD)前脑皮质群体。与对照组相比,3D AD突变培养中神经突和突触的形成明显受损,但在2D中没有复制,突出了这些传统2D细胞培养模型的缺陷。为了研究AD 3D和2D模型中神经突生长受损的机制,我们评估了两种情况下淀粉样蛋白-β功能障碍、线粒体健康和氧化应激。在3D模型中,APP突变培养表现出线粒体膜电位降低和网络碎片化,表明功能障碍和潜在的细胞能量不足。此外,在3D AD模型中,氧化应激升高和蛋白质平衡破坏被确定为细胞损伤的指标,这可能限制了神经突的延伸。此外,转录组学(散装RNA-Seq)分析显示,2D和3D AD模型之间的基因表达途径存在明显差异,表明不同培养条件下疾病病理的潜在机制存在差异。这项研究证明了这种新型3D生物打印模型在量化神经突连通性和识别潜在疾病机制方面的功能。
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来源期刊
Bioengineering
Bioengineering Chemical Engineering-Bioengineering
CiteScore
4.00
自引率
8.70%
发文量
661
期刊介绍: Aims Bioengineering (ISSN 2306-5354) provides an advanced forum for the science and technology of bioengineering. It publishes original research papers, comprehensive reviews, communications and case reports. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. All aspects of bioengineering are welcomed from theoretical concepts to education and applications. There is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. There are, in addition, four key features of this Journal: ● We are introducing a new concept in scientific and technical publications “The Translational Case Report in Bioengineering”. It is a descriptive explanatory analysis of a transformative or translational event. Understanding that the goal of bioengineering scholarship is to advance towards a transformative or clinical solution to an identified transformative/clinical need, the translational case report is used to explore causation in order to find underlying principles that may guide other similar transformative/translational undertakings. ● Manuscripts regarding research proposals and research ideas will be particularly welcomed. ● Electronic files and software regarding the full details of the calculation and experimental procedure, if unable to be published in a normal way, can be deposited as supplementary material. ● We also accept manuscripts communicating to a broader audience with regard to research projects financed with public funds. Scope ● Bionics and biological cybernetics: implantology; bio–abio interfaces ● Bioelectronics: wearable electronics; implantable electronics; “more than Moore” electronics; bioelectronics devices ● Bioprocess and biosystems engineering and applications: bioprocess design; biocatalysis; bioseparation and bioreactors; bioinformatics; bioenergy; etc. ● Biomolecular, cellular and tissue engineering and applications: tissue engineering; chromosome engineering; embryo engineering; cellular, molecular and synthetic biology; metabolic engineering; bio-nanotechnology; micro/nano technologies; genetic engineering; transgenic technology ● Biomedical engineering and applications: biomechatronics; biomedical electronics; biomechanics; biomaterials; biomimetics; biomedical diagnostics; biomedical therapy; biomedical devices; sensors and circuits; biomedical imaging and medical information systems; implants and regenerative medicine; neurotechnology; clinical engineering; rehabilitation engineering ● Biochemical engineering and applications: metabolic pathway engineering; modeling and simulation ● Translational bioengineering
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