Enhanced geopolymer composites with conductive fiber reinforcement: Mechanical, microstructural, and electrical curing performance

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2025-03-29 DOI:10.1016/j.matlet.2025.138495

Nejib Ghazouani , Abdellatif Selmi , Zeeshan Ahmad , Nabil Ben Kahla , Abdelkader Mabrouk

引用次数: 0

Abstract

This study investigates the effects of conductive additives—basalt fiber (BF), steel fiber (SF), wire erosion (WE), and carbon black (CB)—on the mechanical and microstructural properties of geopolymer (GP) cured via electricity-driven thermal curing. A series of 13 GP mixes, incorporating varying fiber concentrations (0.25 %, 0.50 %, 0.75 %), were evaluated for compressive strength (CS), flexural strength (FS), and ultrasonic pulse velocity (UPV). The optimal formulation with 0.5 % WE, exhibited a peak CS of 65.34 MPa, a 94.36 % increase over the control. FS peaked at 16 MPa for 0.75 % WE. UPV results indicated enhanced material densification, with 0.25 % BF reaching a maximum of 2317.83 m/s. SEM/EDX analysis confirmed improved microstructural integrity, while XRD analysis verified geopolymerization.

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导电纤维增强地聚合物复合材料：机械、微结构和电固化性能

研究了玄武岩纤维（BF）、钢纤维（SF）、金属丝侵蚀（WE）和炭黑（CB）等导电助剂对电驱动热固化地聚合物（GP）力学和微观结构性能的影响。采用不同纤维浓度（0.25%、0.50%、0.75%）的13种GP混合料，对其抗压强度（CS）、抗折强度（FS）和超声脉冲速度（UPV）进行了评估。结果表明，以0.5% WE为最佳配比时，CS峰值为65.34 MPa，比对照提高了94.36%。当WE为0.75%时，FS峰值为16 MPa。UPV结果表明，0.25%的BF最大可达2317.83 m/s，增强了材料的致密性。SEM/EDX分析证实了微观结构的完整性，而XRD分析证实了地聚合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive