Improving the electromagnetic interference shielding performance of CNTs/copper composites by interface modification with a carbon buffer layer

Abstract

Electromagnetic interference (EMI) poses a significant threat to human health and electronic devices, necessitating the development of effective shielding materials. While metals offer excellent EMI shielding performance, their weight, corrosion susceptibility, and cost limit their applications. Composites of carbon nanotubes (CNTs) and metals are promising candidates for light-weight EMI shielding materials, while compromise always has to be made between the EMI shielding performance and the weight. This study investigates a novel approach to enhance the EMI shielding performance of CNT/copper composites avoiding weight increase by introducing a highly disordered graphite nanosheet (HDGN) buffer layer between the CNTs and copper. The HDGN buffer effectively fills gaps in the CNT network, creating a smooth and continuous interface with the copper layer. This modification significantly improves the electrical conductivity and EMI shielding effectiveness (EMI SE) of the composites. This study highlights the crucial role of the metal/carbon interface in determining the EMI shielding performance, offering valuable insights for the design and optimization of lightweight, flexible, and efficient EMI shielding materials.