Study on the dielectric properties of fluorinated graphene

Abstract

The rapid evolution of fifth-generation (5G) communication technology calls for next-generation packaging materials that not only excel in dielectric performance like dielectric constant and dielectric loss but push the demand for thermal stability. Here, we explore superhydrophobic fluorinated graphene (FG), revealing a remarkable combination of dielectric properties and thermal stability that make FG a standout candidate for electronic packaging in 5G applications. By fine-tuning the fluorine-to‑carbon (F/C) ratio in the FG, we have achieved a dielectric constant as low as 1.50 with an F/C ratio of 1.18, significantly lower than many conventional materials. Even more impressively, our FG exhibits an ultra-low dielectric loss of just 0.0037 at 10 MHz. Beyond its outstanding electrical performance, FG boasts exceptional thermal stability, with a decomposition temperature high to ∼500 °C, far surpassing standard polymers for packaging materials. Moreover, its hydrophobic nature remains stable in outdoor environments, cementing its reliability over time. With its low dielectric constant, minimal dielectric loss, high thermal resilience, and environmental durability, FG holds tremendous promise as a competitive candidate in advanced packaging materials for 5G technology.