Effect of a novel alginate/5-aminovaleric acid slurry with CeO2/MoS2 abrasives on surface roughness and material removal rate of quartz glass

Abstract

Chemical mechanical polishing (CMP) technology is an effective method for improving the surface planarization of quartz glass. However, the high cost of abrasive modification and the presence of toxic chemical components in the reagents pose significant challenges to the practical application of CMP. Therefore, it is imperative to develop an efficient quartz glass polishing slurry that is cost-effective and environmentally friendly. In this study, an efficient polishing slurry was developed containing cerium oxide (CeO₂) abrasive, sodium alginate (ALG), and 5-aminovaleric acid (5-AVA). Notably, the quartz glass material removal rate (MRR) reached 31.57 μm/h after cyclic polishing with the novel slurry. The combination of 5-AVA and ALG forms a complex with a large number of polar groups, as revealed by X-ray photoelectron spectroscopy (XPS), Fourier-transform infrared spectroscopy (FTIR), and Raman spectroscopy. Additionally, the physical properties of MoS₂ nanomaterials were utilized as a buffer layer between the polishing pad and the polished workpiece, reducing friction and thereby improving the surface quality of quartz glass. These findings provide novel insights and concepts for enhancing the performance of CMP in quartz glass applications.