Effects of a 50 nm AlN intermediate layer on the properties of Al1-xScxN films with varying Sc concentrations

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-04-01 DOI:10.1016/j.mssp.2025.109529
Huanneng Zhu , Jin Wu , Zhenhuai Yang , Kesheng Guo , Jing Liu , Chuandong Zhang , Jie Bai , Hong Liu , Qiang Hu , Qiang Wang
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Abstract

This study fabricated Al1-xScxN thin films with varying Sc doping concentrations on c-sapphire substrates using dual-target magnetron sputtering, and analyzed the impact of a 50-nm-thick AlN intermediate layer. By precisely adjusting the radio frequency power of the Sc target, films with doping concentrations ranging from 8 % to 32 % are obtained. The absence of the AlN intermediate layer, high Sc-doped films exhibit poor quality and significant phase separation on c-sapphire substrates. In contrast, upon the introduction of the intermediate layer, only the peak of the 0002 reflection of the wurtzite phase is manifested, accompanied by a remarkable enhancement in crystallinity and a substantial reduction in residual stress. X-ray photoelectron spectroscopy (XPS) analysis indicates that the intermediate layer strengthens the Sc-N bonds and reduces oxygen impurities. Optical characterizations reveal that the films containing this intermediate layer exhibit higher transmittance in the ultraviolet–visible region beyond the absorption edge, and their direct bandgap is closer to the theoretical value. This study verifies the crucial role of the AlN intermediate layer in optimizing the properties of Al1-xScxN films. It provides some theoretical basis for the application of the AlScN/AlN/c-sapphire structure in devices such as high-performance radio-frequency filters and ultraviolet solar-blind detectors, which is conducive to enhancing the performance of these devices in relevant fields and expanding their functions.
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50 nm AlN中间层对不同Sc浓度Al1-xScxN薄膜性能的影响
本研究利用双靶磁控溅射技术在 c-sapphire 衬底上制造了不同 Sc 掺杂浓度的 Al1-xScxN 薄膜,并分析了 50 纳米厚的 AlN 中间层的影响。通过精确调节 Sc 靶件的射频功率,可以获得掺杂浓度为 8% 至 32% 的薄膜。在没有 AlN 中间层的情况下,高掺杂 Sc 的薄膜质量较差,在 c 蓝宝石基底上会出现明显的相分离现象。相反,在引入中间层后,只出现了乌兹晶相的 0002 反射峰,同时结晶度显著提高,残余应力大幅降低。X 射线光电子能谱(XPS)分析表明,中间层加强了 Sc-N 键并减少了氧杂质。光学表征显示,含有该中间层的薄膜在吸收边缘以外的紫外-可见光区域表现出更高的透射率,其直接带隙更接近理论值。这项研究验证了 AlN 中间层在优化 Al1-xScxN 薄膜性能方面的关键作用。它为 AlScN/AlN/c-蓝宝石结构在高性能射频滤波器和紫外线日盲探测器等器件中的应用提供了一定的理论依据,有利于提高这些器件在相关领域的性能,拓展其功能。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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