Effect of superhydrophobic microstructures on the heat transfer performance of surgical electrode: Droplet and bubble dynamics investigation

IF 3.6 2区 物理与天体物理 Q2 PHYSICS, APPLIED Applied Physics Letters Pub Date : 2025-04-08 DOI:10.1063/5.0249968
Jiao Gao, Jiaao Zhang, Kaikai Li, Longsheng Lu
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Abstract

Severe thermal damage to biological tissue resulting from active electrosurgical electrodes often causes corresponding tissue adhesion and reduces cutting efficiency during the surgery process. The introduction of superhydrophobic surfaces has been proven to be an effective approach for thermal damage reduction and anti-adhesion. However, the heat transfer phenomenon, especially the effect of superhydrophobic microstructures on the electrodes, has not been fully illustrated. In this study, we investigated the water droplet behavior on a superhydrophobic micro-channel (SHMC) surface and bubble dynamics of identically structured electrodes under thermal and thermoelectric coupling fields. The thicker vapor film, caused by the trapped air within microstructures on the SHMC surface, resulted in a reduced evaporation speed of droplets. Moreover, under the thermo-electric coupling field, the SHMC surface exhibited notable three-stage bubble evolution compared to the flat surface: Enhanced bubble coalescence in the initial stage, attributed to accelerated single bubble growth rates; Surface-wide nucleation with subsequent adhesion and merging events in the transition stage; Sustained tip-encapsulation in the stable stage, resulting from increased bubble generation frequency and extended departure diameters. The vapor film that continuously encapsulates the microstructures alters the heat transfer mode from thermal convection to thermal conduction and radiation, inhibiting the heat transfer of the SHMC surface. Consequently, the heat dissipation performance is enhanced, reducing the thermal damage to the biological tissue. These findings provide support for understanding the thermal damage-reducing mechanism of superhydrophobic surfaces on electrosurgical electrodes.
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超疏水微结构对手术电极传热性能的影响:液滴和气泡动力学研究
活性电外科电极对生物组织造成的严重热损伤往往会导致相应的组织粘连,降低手术过程中的切割效率。事实证明,引入超疏水表面是减少热损伤和防粘连的有效方法。然而,热传导现象,尤其是超疏水微结构对电极的影响尚未得到充分说明。在本研究中,我们研究了超疏水微通道(SHMC)表面上的水滴行为以及相同结构电极在热场和热电耦合场下的气泡动力学。由于超疏水微通道表面的微结构中存在滞留空气,因此水汽膜较厚,从而降低了水滴的蒸发速度。此外,在热电耦合场下,与平面相比,SHMC 表面表现出显著的三阶段气泡演化:在初始阶段,气泡凝聚增强,这归因于单个气泡生长速度加快;在过渡阶段,气泡在整个表面成核,随后发生粘附和合并事件;在稳定阶段,由于气泡生成频率增加和离开直径扩大,气泡尖端被持续包裹。持续包裹微结构的蒸汽膜改变了热传导模式,从热对流变为热传导和辐射,抑制了 SHMC 表面的热传导。因此,散热性能得到增强,减少了对生物组织的热损伤。这些发现为理解电外科电极超疏水表面的热损伤减少机制提供了支持。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Applied Physics Letters
Applied Physics Letters 物理-物理:应用
CiteScore
6.40
自引率
10.00%
发文量
1821
审稿时长
1.6 months
期刊介绍: Applied Physics Letters (APL) features concise, up-to-date reports on significant new findings in applied physics. Emphasizing rapid dissemination of key data and new physical insights, APL offers prompt publication of new experimental and theoretical papers reporting applications of physics phenomena to all branches of science, engineering, and modern technology. In addition to regular articles, the journal also publishes invited Fast Track, Perspectives, and in-depth Editorials which report on cutting-edge areas in applied physics. APL Perspectives are forward-looking invited letters which highlight recent developments or discoveries. Emphasis is placed on very recent developments, potentially disruptive technologies, open questions and possible solutions. They also include a mini-roadmap detailing where the community should direct efforts in order for the phenomena to be viable for application and the challenges associated with meeting that performance threshold. Perspectives are characterized by personal viewpoints and opinions of recognized experts in the field. Fast Track articles are invited original research articles that report results that are particularly novel and important or provide a significant advancement in an emerging field. Because of the urgency and scientific importance of the work, the peer review process is accelerated. If, during the review process, it becomes apparent that the paper does not meet the Fast Track criterion, it is returned to a normal track.
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