Realizing high thermoelectric power factor and stability of AlSnTe2 alloy thin film

IF 6.4 2区 工程技术 Q1 MECHANICS International Communications in Heat and Mass Transfer Pub Date : 2025-05-01 Epub Date: 2025-04-09 DOI:10.1016/j.icheatmasstransfer.2025.108943
Arslan Ashfaq , Muhammad Yasir Ali , Adnan Ali , Khalid Mehmood , Meznah M. Alanazi , Tagreed Wael Alghamdi , Ahmed H. Ragab
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Abstract

This study investigates the thermoelectric properties of AlSnTe2 thin films, emphasizing the impact of post-annealing treatments on enhancing the thermoelectric power factor (PF) and overall stability. Scanning electron microscopy (SEM) analysis reveals that the as-grown films feature a smooth surface with large grains up to 1.76 μm in size. Post-annealing for durations of 1 to 3 h resulted in a significant transformation in the grain structure, with the most notable changes occurring after 3 h, where larger grains transitioned to smaller, metallic-like grains. The electrical conductivity increased from 388 S/cm in the as-grown sample to 432 S/cm following 3 h of annealing, attributed to improved grain connectivity and reduced scattering centers. Concurrently, the charge carrier concentration rose significantly from 1.05 × 1020 cm−3 to 2.59 × 1020 cm−3, driven by the formation of conductive secondary phases that minimized defect density. However, charge carrier mobility decreased from 21.05 cm2V−1 s−1 to 12.02 cm2V−1 s−1 due to increased carrier-carrier scattering at higher concentrations. The Seebeck coefficient exhibited n-type behavior, with values increasing from 128 μV/K to 171 μV/K as temperature rose from 300 K to 450 K. The maximum power factor of 10.29 μWcm−1 K−2 was achieved in the sample post-annealed for one hour at 450 K, demonstrating a balance between the Seebeck coefficient and electrical conductivity. These findings underscore the potential of AlSnTe2 alloys for thermoelectric applications, highlighting the critical role of post-annealing in optimizing performance.
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实现了AlSnTe2合金薄膜的高热电功率因数和稳定性
本研究研究了AlSnTe2薄膜的热电性能,强调了退火处理对提高热电功率因子(PF)和整体稳定性的影响。扫描电镜(SEM)分析表明,薄膜表面光滑,晶粒尺寸可达1.76 μm。退火1 ~ 3h后,晶粒结构发生了显著的变化,其中最显著的变化发生在3h后,较大的晶粒转变为较小的金属状晶粒。电导率从生长样品的388 S/cm提高到退火3 h后的432 S/cm,这是由于晶粒连通性提高和散射中心减少。同时,电荷载流子浓度从1.05 × 1020 cm−3显著上升到2.59 × 1020 cm−3,这是由于导电二次相的形成使缺陷密度最小化。然而,电荷载流子迁移率从21.05 cm2V−1 s−1下降到12.02 cm2V−1 s−1,这是由于在较高浓度下载流子-载流子散射的增加。Seebeck系数表现为n型行为,随着温度从300 K升高到450 K, Seebeck系数从128 μV/K增加到171 μV/K。在450 K下退火1小时后,样品的最大功率因数为10.29 μWcm−1 K−2,证明了塞贝克系数和电导率之间的平衡。这些发现强调了AlSnTe2合金在热电应用中的潜力,强调了后退火在优化性能中的关键作用。
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来源期刊
CiteScore
11.00
自引率
10.00%
发文量
648
审稿时长
32 days
期刊介绍: International Communications in Heat and Mass Transfer serves as a world forum for the rapid dissemination of new ideas, new measurement techniques, preliminary findings of ongoing investigations, discussions, and criticisms in the field of heat and mass transfer. Two types of manuscript will be considered for publication: communications (short reports of new work or discussions of work which has already been published) and summaries (abstracts of reports, theses or manuscripts which are too long for publication in full). Together with its companion publication, International Journal of Heat and Mass Transfer, with which it shares the same Board of Editors, this journal is read by research workers and engineers throughout the world.
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