An improved high-temperature resistant electrical connection structure based on polymer-derived ceramic SiCN for thin-film sensors

IF 5.6 2区材料科学 Q1 MATERIALS SCIENCE, CERAMICS Ceramics International Pub Date : 2025-04-01 DOI:10.1016/j.ceramint.2025.01.028

Zaifu Cui, Huayu Che, Wenjin Duan, Zhenguo Lu, Huaxiu Liang, Huiting Zeng, Bohuai Gou, Yihan Zhang, Shuo Chen, Zhaohong Jiang, Jiahong Huang, Xiaojun Chen

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Abstract

High-temperature-resistant thin-film sensors can quickly and accurately obtain signals such as temperature, heat flux, and strain from surfaces in high-temperature applications, and the reliability of the sensors is determined by the quality of the lead electrical connection structure of the high-temperature-resistant thin-film sensors. Aiming at the challenges of complicated process and high cost of the lead electrical connection structure of high temperature resistant thin-film sensors, a lead electrical connection structure is proposed based on polymer-derived ceramics (PDC). The lead connector was prepared using a high-temperature wire and polymer-derived ceramics, and then the lead connector and the lead film were sintered together by PDC paste to obtain the electrical connection between the lead film and the high-temperature wire. The surface morphology and electrical properties as well as the high-temperature stability of the lead connector were characterized, and the proposed lead electrical connection structure was also used for polymer-derived ceramic thin-film thermistors, and multiple rounds of resistance temperature tests were conducted from room temperature to 800 °C. The results show that the lead connector has an oxide layer on the surface and a conductive layer on the inside, and the structure can withstand temperatures up to 1100 °C with good high-temperature stability, which makes it possible to be used for high-temperature-resistant polymer-derived ceramic thin-film sensors. A low-cost and simple process high-temperature lead electrical connection structure is provided for high-temperature-resistant thin-film sensors.

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一种改进的基于聚合物衍生陶瓷SiCN的薄膜传感器耐高温电连接结构

耐高温薄膜传感器可快速准确地获取高温应用中表面的温度、热通量和应变等信号，而传感器的可靠性取决于耐高温薄膜传感器引线电连接结构的质量。针对耐高温薄膜传感器引线电连接结构工艺复杂、成本高的难题，提出了一种基于聚合物衍生陶瓷（PDC）的引线电连接结构。利用高温导线和聚合物陶瓷制备了引线连接器，然后用 PDC 浆料将引线连接器和引线薄膜烧结在一起，获得了引线薄膜和高温导线之间的电连接。表征了引线连接器的表面形貌和电学特性以及高温稳定性，并将所提出的引线电连接结构用于聚合物衍生陶瓷薄膜热敏电阻，进行了从室温到 800 °C 的多轮电阻温度测试。结果表明，引线连接器表面有氧化层，内部有导电层，该结构可承受高达 1100 ℃ 的温度，具有良好的高温稳定性，因此可用于耐高温聚合物衍生陶瓷薄膜传感器。为耐高温薄膜传感器提供了一种成本低、工艺简单的高温引线电连接结构。

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来源期刊

Ceramics International 工程技术-材料科学：硅酸盐

CiteScore

9.40

自引率

15.40%

发文量

4558

审稿时长

25 days

期刊介绍： Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.