Microstructure and damping capacity of high-temperature damping ZA27/7075Al composites prepared by friction stir processing

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2025-04-18 DOI:10.1016/j.matlet.2025.138599
Lin Fu , Hongjie Jiang , Kai Huang , Hao Cheng , Chongyu Liu , Hongfeng Huang , Shuhui Liu
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Abstract

FSP-ZA27/7075Al composites with enhanced high-temperature damping capacity were fabricated using friction stir processing. The interface bonding between the ZA27 and 7075Al alloys is strong, with no apparent defects or new phase formation in the composites. The improved damping capacity and comprehensive damping index of the composites, in comparison to the 7075Al alloy, result from the contributions of grain refinement and the inherent damping capacity of the reinforcement phase. At 300 °C, the internal friction value of the composites is 798 % and 1258 % greater than that of FSP-7075Al and 7075-T651 Al alloys, respectively. At 275 °C, the composites show internal friction peaks similar to those of the ZA27 alloy.

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搅拌摩擦法制备ZA27/7075Al高温阻尼复合材料的组织与阻尼性能
采用搅拌摩擦法制备了高温阻尼性能增强的FSP-ZA27/7075Al复合材料。复合材料中ZA27和7075Al合金的界面结合较强,没有明显的缺陷和新相形成。与7075Al合金相比,复合材料的阻尼能力和综合阻尼指数的提高是晶粒细化和增强相固有阻尼能力的贡献。在300℃时,复合材料的内摩擦值分别比FSP-7075Al和7075-T651 Al合金高798%和1258%。在275℃时,复合材料的内摩擦峰与ZA27合金相似。
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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