Revisiting thermal transport in ThO2 using higher-order thermal transport physics

IF 3.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Computational Materials Science Pub Date : 2025-04-19 DOI:10.1016/j.commatsci.2025.113882
Nidheesh Virakante, Ankit Jain
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Abstract

The effect of inclusion of higher-order thermal transport physics (viz. temperature-dependent interatomic force constants, phonon renormalization, and four-phonon scattering) on the computation of phonon frequencies and lattice thermal conductivity of ThO2 is explored, employing LDA, PBE, and PBEsol exchange–correlational functionals. Upon renormalization, the frequencies are stiffened for the optical phonon modes, whereas the acoustic modes remain unchanged. Thermal conductivity computed using LDA and PBEsol functionals are within 5% of the experimentally measured values at 300 K, whereas that obtained using PBE functional results in an undeprediction of 25%. The temperature-dependent force constants and renormalized phonon frequencies significantly affect the computed lattice thermal conductivity at higher temperatures (40% difference at 1000 K), whereas four-phonon processes have minimal effects (only 10% at 1000 K).
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用高阶热输运物理重述ThO2中的热输运
利用 LDA、PBE 和 PBEsol 交换相关函数,探讨了加入高阶热传输物理(即与温度相关的原子间力常数、声子重正化和四声子散射)对二氧化硫声子频率和晶格热导率计算的影响。重正化后,光学声子模式的频率变得更强,而声学模式保持不变。使用 LDA 和 PBEsol 函数计算出的热导率与 300 K 时的实验测量值相差 5%,而使用 PBE 函数计算出的热导率与实验测量值相差 25%。在较高温度下,与温度相关的力常数和重规范化声子频率对计算出的晶格热导率有很大影响(1000 K 时相差 40%),而四声子过程的影响则很小(1000 K 时仅相差 10%)。
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来源期刊
Computational Materials Science
Computational Materials Science 工程技术-材料科学:综合
CiteScore
6.50
自引率
6.10%
发文量
665
审稿时长
26 days
期刊介绍: The goal of Computational Materials Science is to report on results that provide new or unique insights into, or significantly expand our understanding of, the properties of materials or phenomena associated with their design, synthesis, processing, characterization, and utilization. To be relevant to the journal, the results should be applied or applicable to specific material systems that are discussed within the submission.
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