{"title":"Study on Lifetime Modeling of IGBT Modules Considering Electric Frequency Influence Mechanism","authors":"Wei Lai;Anbin Liu;Zhi Wang;Miaomiao Shangguan;Hui Li;Minyou Chen;Ran Yao;Yan Xiong","doi":"10.1109/TDMR.2023.3288144","DOIUrl":null,"url":null,"abstract":"Affected by the randomness of the wind speed, the output electric frequency (0~20Hz) of the rotor-side converter does not match the thermal time constant (about 100ms) of IGBT modules, which causes the different junction temperature stress. It leads that it is difficult for the traditional lifetime model to reflect the influence of multi-time constant thermal load and result in inaccurate reliability evaluation. Aiming at the characteristics of wind turbine-side converters bearing thermal loads with multiple time constants, this paper studies the influence mechanism of electric frequency on the reliability of IGBT modules through a multi-physics simulation model and power cycling tests, and an improved lifetime model considering the influence of frequency parameters is proposed. Finally, an example analysis of the reliability evaluation of the DFIG rotor side converter is carried out. This paper is intended for the health management of converter systems and is supposed to be in service reliably.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"23 3","pages":"395-403"},"PeriodicalIF":2.5000,"publicationDate":"2023-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10159550/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Affected by the randomness of the wind speed, the output electric frequency (0~20Hz) of the rotor-side converter does not match the thermal time constant (about 100ms) of IGBT modules, which causes the different junction temperature stress. It leads that it is difficult for the traditional lifetime model to reflect the influence of multi-time constant thermal load and result in inaccurate reliability evaluation. Aiming at the characteristics of wind turbine-side converters bearing thermal loads with multiple time constants, this paper studies the influence mechanism of electric frequency on the reliability of IGBT modules through a multi-physics simulation model and power cycling tests, and an improved lifetime model considering the influence of frequency parameters is proposed. Finally, an example analysis of the reliability evaluation of the DFIG rotor side converter is carried out. This paper is intended for the health management of converter systems and is supposed to be in service reliably.
期刊介绍：
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
