Design, analysis, and experimental investigation of micro-displacement amplification compliant mechanism for micro-transducers.

Abstract

This paper presents experimental force and buckling analysis of a compliant micro-displacement amplification mechanism fabricated using the commercially available PolyMUMPs process. The proposed mechanism proficiently amplifies displacement, at two output ends, with an optimal amplification factor of 7.2. Buckling analysis revealed that an amplification factor ranging from 2.8 to 11 may be achieved for an input displacement varying from 0.1 to 7.5 µm. Based on the analysis, the optimal value of the amplification factor is found to be 7.2 with an input displacement of 3.5 µm at the operational force of 60 μN having a buckling load factor (BLF) >1. Critical load magnitude is 187 μN having BLF = 1. Buckling occurred when loading exceeded the critical load value, having BLF <1, and the mechanism failed to produce a significant amplification factor. Static analysis showed that stresses produced are within the safe region, and the structural integrity of the mechanism is not compromised having a factor of safety of 1.4. Modal analysis predicted that the natural frequency of the desired mode is 35.47 kHz. Dynamic simulations, under 15 g dynamic load with a frequency range of 30-40 kHz, confirm the possibility of integrating the proposed mechanism with MEMS devices. Parametric optimization comprehends that length and angle are the two major geometric parameters that govern the working range, force, and amplification factor. For input displacements below 1 µm, the amplification factor is even higher, which is highly beneficial for amplifying small displacements. Static, modal, and dynamic analyses of the designed mechanism have been carried out using finite element method based commercial software IntelliSuite^®. The experimental results showed that this mechanism can provide the same amplified displacement at two output points and is self-sufficient to be incorporated as an intermediate compliant mechanism for enhancing the output in the case of both static and dynamic micro-devices.