Using iMTGSPICE to Optimize Cascaded Miller OTAs and Boost Electrical Performance, Robustness and Reduce Die Area

José Roberto Banin Júnior, Rodrigo Alves de Lima Moreto, G. A. da Silva, Salvador Pinillos Gimenez
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引用次数: 0

Abstract

Analog designers usually cascade several basic analog building blocks that were previously optimized to increase the open-loop voltage gain (AV0) and to avoid the increasing of the Design and Optimization Cycle Time (DOCT) of a given System-On-a-Chip. However, still exist a big doubt about if this approach is really better than that considering the implementation of amplifiers in cascade, without considering previously optimized analog building blocks. Thus, the main objective of this paper is to perform a detailed comparative study between robust amplifiers in cascade implemented without using analog building blocks previously designed and optimized and a similar one that uses analog building blocks previously designed and optimized (typical design approach). The computational design and optimization tool, named iMTGSPICE, which uses heuristics algorithms of the Artificial Intelligence integrated to the expertise of the analog designers (Human Intelligence), is used to perform these implementations to remarkably reduce DOCT of these implementations. This work demonstrates that it is possible to reduce the total gate area (44.6%) and to increase the operating temperature range from 0oC to 36oC to -40oC to 125oC of the robust amplifier in cascade that was implemented without using analog building blocks previously designed and optimized compared to one that was implemented by using analog building blocks previously designed and optimized.
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使用iMTGSPICE优化级联Miller ota,提高电气性能,稳健性并减少模具面积
模拟设计人员通常级联几个基本的模拟构建模块,这些模块先前经过优化,以增加开环电压增益(AV0),并避免增加给定片上系统的设计和优化周期时间(DOCT)。然而,对于这种方法是否真的比考虑级联放大器的实现而不考虑先前优化的模拟构建块的方法更好,仍然存在很大的疑问。因此,本文的主要目的是对不使用先前设计和优化的模拟构建块实现的级联鲁棒放大器与使用先前设计和优化的模拟构建块(典型设计方法)的类似放大器进行详细的比较研究。计算设计和优化工具名为iMTGSPICE,它使用人工智能的启发式算法与模拟设计师(人类智能)的专业知识相结合,用于执行这些实现,以显着减少这些实现的DOCT。这项工作表明,与使用先前设计和优化的模拟构建块实现的级联鲁棒放大器相比,不使用先前设计和优化的模拟构建块实现的级联放大器有可能减少总栅极面积(44.6%),并将工作温度范围从0°c到36°c到-40°c到125°c。
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来源期刊
Journal of Integrated Circuits and Systems
Journal of Integrated Circuits and Systems Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
39
期刊介绍: This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.
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