Daniel Corzo, Guillermo Tostado-Blázquez, D. Baran
{"title":"Flexible Electronics: Status, Challenges and Opportunities","authors":"Daniel Corzo, Guillermo Tostado-Blázquez, D. Baran","doi":"10.3389/felec.2020.594003","DOIUrl":null,"url":null,"abstract":"The concept of flexible electronics has been around for several decades. In principle, anything thin or very long can become flexible. While cables and wiring are the prime example for flexibility, it was not until the space race that silicon wafers used for solar cells in satellites were thinned to increase their power per weight ratio, thus allowing a certain degree of warping. This concept permitted the first flexible solar cells in the 1960s (Crabb and Treble, 1967). The development of conductive polymers (Shirakawa et al., 1977), organic semiconductors, and amorphous silicon (Chittick et al., 1969; Okaniwa et al., 1983) in the following decades meant huge strides toward flexibility and processability, and thus these materials became the base for electronic devices in applications that require bending, rolling, folding, and stretching, among other properties that cannot be fulfilled by conventional electronics (Cheng and Wagner, 2009) (Figure 1). Presently there is great interest in new materials and fabrication techniques which allow for highperformance scalable electronic devices to be manufactured directly onto flexible substrates. This interest has also extended to not only flexibility but also properties like stretchability and healability which can be achieved by utilizing elastomeric substrates with strong molecular interactions (Oh et al., 2016; Kang et al., 2018). Likewise, biocompatibility and biodegradability has been achieved through polymers that do not cause adverse effect to the body and can be broken down into smaller constituent pieces after utilization (Bettinger and Bao, 2010; Irimia-Vladu et al., 2010; Liu H. et al., 2019). This new progress is now enabling devices which can conform to complex and dynamic surfaces, such as those found in biological systems and bioinspired soft robotics. These next-generation flexible electronics open up a wide range of exciting new applications such as flexible lighting and display technologies for consumer electronics, architecture, and textiles, wearables with sensors that help monitor our health and habits, implantable electronics for improved medical imaging and diagnostics, as well as extending the functionality of robots and unmanned aircraft through lightweight and conformable energy harvesting devices and sensors. While conventional electronics are very capable of these functions, flexible electronics are intended to expand the mechanical features to adhere to novel form factors through hybrid strategies, or as standalone solutions where the application does not require high computation power, intended to be highly robust to deformation, low cost, thin, or disposable. The definition of flexibility differs from application to application. From bending and rolling for easier handling of large area photovoltaics, to conforming onto irregular shapes, folding, twisting, stretching, and deforming required for devices in electronic skin, all while maintaining device performance and reliability. While early progress and many important innovations have already been achieved, the field of flexible electronics has many challenges before it becomes part of our daily life. This represents a huge opportunity for scientific research and development to rapidly and considerably advance this area (Figure 2). In this article the status, key challenges and opportunities for the field of nextgeneration flexible devices are elaborated in terms of materials, fabrication and specific applications. Edited and Reviewed by: Jhonathan Prieto Rojas, King Fahd University of Petroleum and Minerals, Saudi Arabia","PeriodicalId":73081,"journal":{"name":"Frontiers in electronics","volume":"1 1","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2020-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.3389/felec.2020.594003","citationCount":"102","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Frontiers in electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3389/felec.2020.594003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 102
Abstract
The concept of flexible electronics has been around for several decades. In principle, anything thin or very long can become flexible. While cables and wiring are the prime example for flexibility, it was not until the space race that silicon wafers used for solar cells in satellites were thinned to increase their power per weight ratio, thus allowing a certain degree of warping. This concept permitted the first flexible solar cells in the 1960s (Crabb and Treble, 1967). The development of conductive polymers (Shirakawa et al., 1977), organic semiconductors, and amorphous silicon (Chittick et al., 1969; Okaniwa et al., 1983) in the following decades meant huge strides toward flexibility and processability, and thus these materials became the base for electronic devices in applications that require bending, rolling, folding, and stretching, among other properties that cannot be fulfilled by conventional electronics (Cheng and Wagner, 2009) (Figure 1). Presently there is great interest in new materials and fabrication techniques which allow for highperformance scalable electronic devices to be manufactured directly onto flexible substrates. This interest has also extended to not only flexibility but also properties like stretchability and healability which can be achieved by utilizing elastomeric substrates with strong molecular interactions (Oh et al., 2016; Kang et al., 2018). Likewise, biocompatibility and biodegradability has been achieved through polymers that do not cause adverse effect to the body and can be broken down into smaller constituent pieces after utilization (Bettinger and Bao, 2010; Irimia-Vladu et al., 2010; Liu H. et al., 2019). This new progress is now enabling devices which can conform to complex and dynamic surfaces, such as those found in biological systems and bioinspired soft robotics. These next-generation flexible electronics open up a wide range of exciting new applications such as flexible lighting and display technologies for consumer electronics, architecture, and textiles, wearables with sensors that help monitor our health and habits, implantable electronics for improved medical imaging and diagnostics, as well as extending the functionality of robots and unmanned aircraft through lightweight and conformable energy harvesting devices and sensors. While conventional electronics are very capable of these functions, flexible electronics are intended to expand the mechanical features to adhere to novel form factors through hybrid strategies, or as standalone solutions where the application does not require high computation power, intended to be highly robust to deformation, low cost, thin, or disposable. The definition of flexibility differs from application to application. From bending and rolling for easier handling of large area photovoltaics, to conforming onto irregular shapes, folding, twisting, stretching, and deforming required for devices in electronic skin, all while maintaining device performance and reliability. While early progress and many important innovations have already been achieved, the field of flexible electronics has many challenges before it becomes part of our daily life. This represents a huge opportunity for scientific research and development to rapidly and considerably advance this area (Figure 2). In this article the status, key challenges and opportunities for the field of nextgeneration flexible devices are elaborated in terms of materials, fabrication and specific applications. Edited and Reviewed by: Jhonathan Prieto Rojas, King Fahd University of Petroleum and Minerals, Saudi Arabia
柔性电子的概念已经存在了几十年。原则上,任何细长的东西都可以变得灵活。虽然电缆和布线是灵活性的主要例子,但直到太空竞赛,卫星中用于太阳能电池的硅片才被减薄,以提高其功率重量比,从而允许一定程度的翘曲。这一概念在20世纪60年代允许了第一个柔性太阳能电池(Crabb和Treble,1967)。在接下来的几十年里,导电聚合物(Shirakawa et al.,1977)、有机半导体和非晶硅(Chittick et al.,1969;Okaniwa et al.,1983)的发展意味着在灵活性和可加工性方面取得了巨大进步,因此这些材料成为电子设备在需要弯曲、滚动、折叠和拉伸的应用中的基础,以及传统电子学无法实现的其他特性(Cheng和Wagner,2009)(图1)。目前,人们对新材料和制造技术非常感兴趣,这些新材料和技术允许直接在柔性基板上制造高性能可扩展电子器件。这种兴趣不仅延伸到柔韧性,还延伸到可拉伸性和可愈合性等特性,这些特性可以通过利用具有强分子相互作用的弹性体基质来实现(Oh等人,2016;Kang等人,2018)。同样,生物相容性和生物降解性是通过聚合物实现的,这些聚合物不会对身体造成不利影响,并且在使用后可以分解成更小的组成部分(Bettinger和Bao,2010;Irimia Vladu等人,2010;刘H.等人,2019)。这一新进展现在使设备能够适应复杂和动态的表面,例如在生物系统和仿生软机器人中发现的设备。这些下一代柔性电子产品开辟了一系列令人兴奋的新应用,如用于消费电子产品、建筑和纺织品的柔性照明和显示技术,带传感器的可穿戴设备有助于监测我们的健康和习惯,用于改进医疗成像和诊断的植入式电子产品,以及通过重量轻、适应性强的能量采集设备和传感器扩展机器人和无人驾驶飞机的功能。虽然传统的电子器件非常能够实现这些功能,但柔性电子器件旨在通过混合策略扩展机械特征,以符合新的形状因子,或者作为独立的解决方案,其中应用程序不需要高计算能力,旨在对变形具有高鲁棒性、低成本、薄或一次性。灵活性的定义因应用而异。从弯曲和滚动更容易处理大面积光伏,到适应电子皮肤中设备所需的不规则形状、折叠、扭曲、拉伸和变形,同时保持设备性能和可靠性。虽然已经取得了早期进展和许多重要创新,但在柔性电子领域成为我们日常生活的一部分之前,它还面临着许多挑战。这为科学研究和发展提供了一个巨大的机会,可以迅速而显著地推进这一领域(图2)。本文从材料、制造和具体应用等方面阐述了下一代柔性器件的现状、关键挑战和机遇。编辑和审核:Jhonathan Prieto Rojas,沙特阿拉伯法赫德国王石油矿产大学