Cristina Georgiana Lateş, Cristina Mihaela Dragan, C. Dumitraș
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引用次数: 0
Abstract
The current paper aims to present a thermal dissipation optimization for an Electronic Control Unit (ECU) cooled with thermal paste. The improvement consists of replacing the inside air of the module with four single-phase dielectric coolants in natural convection and one silicone elastomer compound, each of which has a higher thermal conductivity than air. Two distinct experiments were performed: electronics immersed in coolant with and without thermal paste, exposed to an ambient temperature of between -40°C and 105°C. Temperature measurements on the hot spots of these solutions were compared to electronic modules that are cooled only with thermal paste.
期刊介绍：
The main topics of the journal are: Micro & Nano Technologies; Rapid Prototyping Technologies; High Speed Manufacturing Processes; Ecological Technologies in Machine Manufacturing; Manufacturing and Automation; Flexible Manufacturing; New Manufacturing Processes; Design, Control and Exploitation; Assembly and Disassembly; Cold Forming Technologies; Optimization of Experimental Research and Manufacturing Processes; Maintenance, Reliability, Life Cycle Time and Cost; CAD/CAM/CAE/CAX Integrated Systems; Composite Materials Technologies; Non-conventional Technologies; Concurrent Engineering; Virtual Manufacturing; Innovation, Creativity and Industrial Development.
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