New Process Simulation Procedure for High-Rate Plasma Jet Machining

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL Plasma Chemistry and Plasma Processing Pub Date : 2010-11-04 DOI:10.1007/s11090-010-9267-y

Johannes Meister, Thomas Arnold

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引用次数: 45

Abstract

Surface figuring using chemically reactive plasma jet machining (PJM) is a promising non-conventional technology for deterministic ultra-precision machining of optical components. Based on chemical reactions between plasma generated radicals and the surface atoms this technology is capable to fabricate complex shaped free form surfaces. Since the material removal rate during PJM depends strongly on the surface temperature which itself is influenced by the jet heat flux to the surface, the arising nonlinear effects on the etch result have to be regarded. Conventionally applied dwell time calculation algorithms do not consider those effects leading to significant machining errors in some cases. In order to improve the machining procedure with respect to deterministic material removal yielding predictable results a process simulation model has been developed. This model considers spatio-temporal variations of surface temperature and temperature dependent material removal and is able to predict the final workpiece topography after machining.

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高速等离子射流加工新工艺仿真程序

化学反应等离子体射流加工表面成形技术是一种非常有前途的光学元件确定性超精密加工的非传统技术。基于等离子体产生的自由基和表面原子之间的化学反应，该技术能够制造复杂形状的自由曲面。由于PJM过程中的材料去除率在很大程度上取决于表面温度，而表面温度本身又受表面射流热流的影响，因此必须考虑对蚀刻结果产生的非线性影响。在某些情况下，传统的停留时间计算算法并没有考虑到这些导致显著加工误差的影响。为了改进加工工艺，使其具有确定性的材料去除并产生可预测的结果，建立了加工过程仿真模型。该模型考虑了表面温度的时空变化和温度相关的材料去除，能够预测加工后的最终工件形貌。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.