Fabrication of silicon nitride membrane nanoelectromechanical resonator

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronic Engineering Pub Date : 2023-08-15 DOI:10.1016/j.mee.2023.112064
Hao Xu, Srisaran Venkatachalam, Christophe Boyaval, Pascal Tilmant, Francois Vaurette, Yves Deblock, Didier Theron, Xin Zhou
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Abstract

In this work, we present details of the nanofabrication process for achieving a silicon nitride nanoelectromechanical resonator, consisting of a membrane covered with a thin aluminium layer capacitively coupled to a suspended top gate. Critical nanofabrication steps have been discussed, including the XeF2 selective etching process to release the silicon nitride membrane from the substrate and the reflow process to fabricate a top gate of a suspended membrane. This ultra-clean and CMOS-compatible process allows the silicon nitride membrane to have a high quality factor (1.1×104) at room temperature and offers access to electrical integration with external circuits with high efficiency. In addition, we also demonstrate parametric amplification and de-amplification of the input signals by exploiting this suspended top gate. The measurement results of phase-sensitive amplifications have also been well fit by analytical caculations. The present work provides essential building blocks for further exploration of silicon nitride membrane based nanoelectromechanical resonators that can be efficiently integrated into large-scale electrical circuits.

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氮化硅膜纳米机电谐振器的制备
在这项工作中,我们详细介绍了实现氮化硅纳米机电谐振器的纳米制造过程,该谐振器由覆盖有薄铝层的膜电容耦合到悬浮顶门组成。讨论了关键的纳米加工步骤,包括从衬底上释放氮化硅膜的XeF2选择性蚀刻工艺和制作悬浮膜顶栅的回流工艺。这种超清洁和cmos兼容的工艺使氮化硅膜在室温下具有高质量因子(~ 1.1×104),并提供与外部电路的高效率电气集成。此外,我们还演示了通过利用该悬顶门对输入信号进行参数放大和去放大。通过分析计算,相敏放大器的测量结果也得到了很好的拟合。目前的工作为进一步探索氮化硅膜基纳米机电谐振器提供了必要的基础,这些谐振器可以有效地集成到大规模电路中。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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