Polymer-based nanocomposites in semiconductor packaging

IF 3.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IET Nanodielectrics Pub Date : 2023-04-18 DOI:10.1049/nde2.12050
Tengyu Li, Peng Li, Rong Sun, Shuhui Yu
{"title":"Polymer-based nanocomposites in semiconductor packaging","authors":"Tengyu Li,&nbsp;Peng Li,&nbsp;Rong Sun,&nbsp;Shuhui Yu","doi":"10.1049/nde2.12050","DOIUrl":null,"url":null,"abstract":"<p>Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer-based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer-based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next-generation polymer-based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.</p>","PeriodicalId":36855,"journal":{"name":"IET Nanodielectrics","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2023-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/nde2.12050","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Nanodielectrics","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/nde2.12050","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer-based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer-based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next-generation polymer-based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

Abstract Image

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
半导体封装中的聚合物基纳米复合材料
半导体封装材料在半导体器件的发展中起着至关重要的作用。它们不仅提供可靠的保护和支持,而且还有助于芯片与外部电路之间的电气连接。在众多的包装材料选择中,聚合物基纳米复合材料因其低成本、易加工和可调的特性而成为主流候选材料。半导体封装通常要求材料具有低介电常数和介电损耗、高玻璃化转变温度、快速导热、合适的热膨胀系数、低粘度和良好的可加工性,但大多数聚合物都不能满足这些要求。因此,调制聚合物基体、引入合适的填料和改性填料表面往往是提高复合材料性能的有效途径。本文首先综述了聚合物基纳米复合材料在五种不同类型封装领域的研究进展,即成型化合物、热界面材料、下填料、模附材料和基板。展望了用于先进半导体封装的下一代聚合物基纳米复合材料的发展前景,并提出了一些解决现有挑战的建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IET Nanodielectrics
IET Nanodielectrics Materials Science-Materials Chemistry
CiteScore
5.60
自引率
3.70%
发文量
7
审稿时长
21 weeks
期刊最新文献
A combined technique for power transformer fault diagnosis based on k-means clustering and support vector machine Stability of giant dielectric properties in co‐doped rutile TiO2 ceramics under temperature and humidity High‐performance sulphur dioxide sensor: Unveiling the potential of photonic crystal fibre technology Improvement in non-linear electrical conductivity of silicone rubber by incorporating zinc oxide fillers and grafting small polar molecules Traditional fault diagnosis methods for mineral oil-immersed power transformer based on dissolved gas analysis: Past, present and future
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1