Md. Hasan Raza Ansari, Nupur Navlakha, Jyi-Tsong Lin, A. Kranti
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引用次数: 2
Abstract
In this work, we report on the opportunities to enhance the retention time (RT) of an accumulation mode capacitorless DRAM (1T-DRAM) through appropriate material optimization by analyzing different semiconductor materials (Si, Ge, Si1−xGex and GaAs). It is shown that the RT can be considerably enhanced through a combination of (i) a higher bandgap material and (ii) the separation of the storage region from the conduction region. A higher bandgap (GaAs) material helps to achieve a deeper potential well, which reduces band-to-band tunneling, and thus, enhances the RT. The material optimization through GaAs and Ge-based 1T-DRAM achieves a maximum RT of ∼2 s and maximum speed of ∼45 ns, respectively, at a gate length of 50 nm at 85 °C. Results also indicate the trade-off between retention and speed arising out the material properties. The work quantifies the role of material and device parameters for 1T-DRAM.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS