Review of flexible microelectromechanical system sensors and devices

IF 3.5 3区 工程技术 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering Pub Date : 2021-04-27 DOI:10.1063/10.0004301
Xiaopeng Yang, Menglun Zhang
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引用次数: 27

Abstract

Today, the vast majority of microelectromechanical system (MEMS) sensors are mechanically rigid and therefore suffer from disadvantages when used in intimately wearable or bio-integrated applications. By applying new engineering strategies, mechanically bendable and stretchable MEMS devices have been successfully demonstrated. This article reviews recent progress in this area, focusing on high-performance flexible devices based on inorganic thin films. We start with the common design and fabrication strategies for flexibility and stretchability, summarize the recent application-oriented flexible devices, and conclude with criteria and opportunities for the future development of flexible MEMS sensors.
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柔性微机电系统传感器和器件综述
今天,绝大多数微机电系统(MEMS)传感器是机械刚性的,因此在密切可穿戴或生物集成应用中存在缺点。通过应用新的工程策略,机械可弯曲和可拉伸的MEMS器件已成功展示。本文综述了这一领域的最新进展,重点介绍了基于无机薄膜的高性能柔性器件。我们从柔性和可拉伸性的常见设计和制造策略开始,总结了最近面向应用的柔性器件,并总结了柔性MEMS传感器未来发展的标准和机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering
Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering Engineering-Industrial and Manufacturing Engineering
CiteScore
6.50
自引率
0.00%
发文量
1379
审稿时长
14 weeks
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