An micro-level study on the cracking performance of encapsulation-based self-healing resin mineral composites under dynamic load based on XFEM

IF 1.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Multidiscipline Modeling in Materials and Structures Pub Date : 2023-06-06 DOI:10.1108/mmms-01-2023-0010
Huan Huang, Yaqiong Fan, Huiyan Huang, R. Guo
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Abstract

PurposeAs an efficient self-healing intelligent material, the encapsulation-based self-healing resin mineral composite (SHC) has a broad application prospect.Design/methodology/approachAiming at the cracking performance of SHC, the dynamic load condition is employed to replace the traditional static load condition, the initial damage of the material is considered and the triggered cracking process and influencing factors of SHC are analyzed based on the extended finite element method (XFEM). In addition, the mechanism of matrix cracking and microcapsule triggered cracking process is explained from the microscopic point of view, and the cracking performance conditions of SHC are studied. On this basis, the response surface regression analysis method is used to obtain a second-order polynomial model of the microcapsule crack initiation stress, the interface bonding strength and the matching relationship between elastic modulus. Therefore, the model could be used to predict the cracking performance parameters of the microcapsule.FindingsThe interfacial bonding strength has an essential effect on the triggered cracking of the microcapsule. In order to ensure that the microcapsule can be triggered cracking normally, the design strength should meet the following relationship, that is crack initiation stress of microcapsule wall < crack initiation stress of matrix < interface bonding strength. Moreover, the matching relationship between elastic modulus has a significant influence on the triggered cracking of the microcapsule.Originality/valueThe results provide a theoretical basis for further oriented designing of the cracking performance of microcapsules.
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基于XFEM的包封自愈树脂矿物复合材料动载开裂性能微观研究
目的封装型自修复树脂-矿物复合材料作为一种高效的自修复智能材料,具有广阔的应用前景。设计/方法/方法针对SHC的开裂性能,采用动载荷条件代替传统的静载荷条件,考虑材料的初始损伤,并基于扩展有限元法(XFEM)分析了SHC的触发开裂过程和影响因素。此外,从微观角度解释了基体开裂和微胶囊引发开裂的机理,并对SHC的开裂性能条件进行了研究。在此基础上,采用响应面回归分析方法,得到了微胶囊裂纹萌生应力、界面结合强度和弹性模量匹配关系的二阶多项式模型。因此,该模型可用于预测微胶囊的裂解性能参数。发现界面结合强度对微胶囊的触发开裂有重要影响。为了保证微胶囊能够正常引发开裂,设计强度应满足以下关系,即微胶囊壁的裂纹萌生应力<基体的裂纹萌生力<界面结合强度。此外,弹性模量之间的匹配关系对微胶囊的触发开裂有显著影响。原创性/价值研究结果为微胶囊裂解性能的进一步定向设计提供了理论依据。
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来源期刊
CiteScore
3.70
自引率
5.00%
发文量
60
期刊介绍: Multidiscipline Modeling in Materials and Structures is published by Emerald Group Publishing Limited from 2010
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