{"title":"Design and implementation of miniaturized tri-band microwave bandpass filter","authors":"P. P., M. J.","doi":"10.1108/mi-12-2021-0119","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis paper is aimed to study the design of a miniaturized filter with tri-band characteristics. In this paper, perturbation is used to realize circuit miniaturization and multi-band by exploiting the inductive property. During this process, vias are added for twofold benefit, namely, circuit miniaturization and enhanced frequency selectivity at high frequency. Thus, with the introduction of the shorting via, the single-band dual-mode bandpass filter is converted into a tri-band filter with a smaller electrical size.\n\n\nDesign/methodology/approach\nThis paper presents the design and characterization of a miniaturized two-port filter with tri-band operating characteristics. The proposed filter is constructed using a square patch resonator operating at 5.2 GHz with a capacitively coupled feed configuration. A square perturbation is added to the corner of the square patch to achieve diagonal symmetry and to excite dual mode. The perturbation offers a sharp transmission zero defining bandwidth of the proposed filter. In addition, a shorting post is introduced to achieve an 88% size reduction by lowering the operating frequency to 1.8 GHz.\n\n\nFindings\nThe prototype filter has insertion less than 1.2 dB and return loss better than 12 dB throughout all the realized frequency bands. The prototype filter is fabricated and the simulation results are validated using experimental measurements. The realized fractional bandwidths of the proposed bandpass filter are 11/5.6/1 at 1.8/4.6/5.85 GHz, respectively. The quality factor of the proposed antenna is greater than 80 and a peak Q-factor of 387 is realized at 5.85 GHz. The high Q-factor indicates low loss and improved selectivity. The rejection levels in the stopband are greater than 20 dB.\n\n\nOriginality/value\nThe results indicate that the proposed filter is a suitable choice for low-power small-scale wireless systems operating in the microwave bands. The realized filter has the smallest footprint of 0.36λeff × 0.19λeff where λeff is the effective wavelength calculated at the lowest frequency of operation.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2022-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-12-2021-0119","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Purpose
This paper is aimed to study the design of a miniaturized filter with tri-band characteristics. In this paper, perturbation is used to realize circuit miniaturization and multi-band by exploiting the inductive property. During this process, vias are added for twofold benefit, namely, circuit miniaturization and enhanced frequency selectivity at high frequency. Thus, with the introduction of the shorting via, the single-band dual-mode bandpass filter is converted into a tri-band filter with a smaller electrical size.
Design/methodology/approach
This paper presents the design and characterization of a miniaturized two-port filter with tri-band operating characteristics. The proposed filter is constructed using a square patch resonator operating at 5.2 GHz with a capacitively coupled feed configuration. A square perturbation is added to the corner of the square patch to achieve diagonal symmetry and to excite dual mode. The perturbation offers a sharp transmission zero defining bandwidth of the proposed filter. In addition, a shorting post is introduced to achieve an 88% size reduction by lowering the operating frequency to 1.8 GHz.
Findings
The prototype filter has insertion less than 1.2 dB and return loss better than 12 dB throughout all the realized frequency bands. The prototype filter is fabricated and the simulation results are validated using experimental measurements. The realized fractional bandwidths of the proposed bandpass filter are 11/5.6/1 at 1.8/4.6/5.85 GHz, respectively. The quality factor of the proposed antenna is greater than 80 and a peak Q-factor of 387 is realized at 5.85 GHz. The high Q-factor indicates low loss and improved selectivity. The rejection levels in the stopband are greater than 20 dB.
Originality/value
The results indicate that the proposed filter is a suitable choice for low-power small-scale wireless systems operating in the microwave bands. The realized filter has the smallest footprint of 0.36λeff × 0.19λeff where λeff is the effective wavelength calculated at the lowest frequency of operation.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.