{"title":"Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study","authors":"Mohammad A. Gharaibeh","doi":"10.1515/jmbm-2022-0058","DOIUrl":null,"url":null,"abstract":"Abstract This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling technique are employed to perform the analysis. Several peripheral array configurations are considered and compared to the full array systems. The results showed that, for optimum electronic package designs in terms of reliability and cost, it is highly recommended to use peripheral packages having three or four rows of solder interconnects in electronic systems under shock and impact loadings.","PeriodicalId":17354,"journal":{"name":"Journal of the Mechanical Behavior of Materials","volume":"31 1","pages":"535 - 545"},"PeriodicalIF":1.7000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Mechanical Behavior of Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1515/jmbm-2022-0058","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 4
Abstract
Abstract This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling technique are employed to perform the analysis. Several peripheral array configurations are considered and compared to the full array systems. The results showed that, for optimum electronic package designs in terms of reliability and cost, it is highly recommended to use peripheral packages having three or four rows of solder interconnects in electronic systems under shock and impact loadings.
期刊介绍：
The journal focuses on the micromechanics and nanomechanics of materials, the relationship between structure and mechanical properties, material instabilities and fracture, as well as size effects and length/time scale transitions. Articles on cutting edge theory, simulations and experiments – used as tools for revealing novel material properties and designing new devices for structural, thermo-chemo-mechanical, and opto-electro-mechanical applications – are encouraged. Synthesis/processing and related traditional mechanics/materials science themes are not within the scope of JMBM. The Editorial Board also organizes topical issues on emerging areas by invitation. Topics Metals and Alloys Ceramics and Glasses Soils and Geomaterials Concrete and Cementitious Materials Polymers and Composites Wood and Paper Elastomers and Biomaterials Liquid Crystals and Suspensions Electromagnetic and Optoelectronic Materials High-energy Density Storage Materials Monument Restoration and Cultural Heritage Preservation Materials Nanomaterials Complex and Emerging Materials.
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