Simulation of mode II fracture propagation in adhesive joints using a meshless technique

IF 5.3 Q2 MATERIALS SCIENCE, COMPOSITES Composites Part C Open Access Pub Date : 2023-10-01 DOI:10.1016/j.jcomc.2023.100385
D.C. Gonçalves , I.J. Sánchez-Arce , L.D.C. Ramalho , R.D.S.G. Campilho , J. Belinha
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Abstract

Adhesive bonding is extensively used by commanding industries such as automotive and aircraft sectors. Nevertheless, due to the intricate mechanical behaviour of adhesively bonded joints, especially when crack propagation occurs at the adhesive layer, improvement of new numerical techniques to simulate this bonding approach is currently under development. In this work, a recent crack propagation algorithm based on a meshless technique is implemented to analyse mode II fracture propagation in adhesively bonded joints. After the problem domain is discretized with an independent set of field nodes, a background numerical integration mesh is constructed. The crack tip advancement is then simulated by iteratively rearranging the field nodes and integration cells at the crack tip. Radial point interpolation (RPI) functions are constructed using the concept of influence domains, allowing to obtain sparse and stable global matrices. To assess the suitability of the proposed method, End-notched flexure (ENF) specimens were manufactured and tested. The numerical simulation justly reproduces the experimental data provided and, thus, the numerical model can be applied to mode-II shear loadings and industrial applications for design purposes.

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基于无网格技术的粘接接头II型断裂扩展模拟
粘合剂粘接广泛应用于汽车和飞机等指挥行业。然而,由于粘接接头的复杂力学行为,特别是当裂纹扩展发生在粘接层时,目前正在开发新的数值技术来模拟这种粘接方法。在这项工作中,实现了一种基于无网格技术的裂纹扩展算法来分析粘接接头的II型断裂扩展。将问题域离散为一组独立的域节点后,构造背景数值积分网格。然后通过迭代重排裂纹尖端的场节点和积分单元来模拟裂纹尖端的推进过程。利用影响域的概念构造径向点插值(RPI)函数,得到稀疏稳定的全局矩阵。为了评估所提出的方法的适用性,端缺口弯曲(ENF)样品被制造和测试。数值模拟正确地再现了所提供的实验数据,因此,数值模型可以用于ii型剪切载荷和工业应用的设计目的。
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来源期刊
Composites Part C Open Access
Composites Part C Open Access Engineering-Mechanical Engineering
CiteScore
8.60
自引率
2.40%
发文量
96
审稿时长
55 days
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