A review on chemical and physical properties of tetrathiomolybdate (TTM) anion drug is useful for TTM treated diseases

IF 3.2 4区 化学 Q2 CHEMISTRY, MULTIDISCIPLINARY Journal of the Indian Chemical Society Pub Date : 2021-08-01 DOI:10.1016/j.jics.2021.100117
Biplab K. Maiti
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引用次数: 1

Abstract

Tetrathiomolybdate anion (MoS42−; TTM) is a promising anti-copper drug, especially for the treatment of copper overloaded diseases such as Wilson diseases (WD) and several forms of cancer. Besides drug, the interest in Cu-TTM interaction expanded when a hetero-metal-cofactor, [Cu(TTM)2]3- was found in the orange protein (ORP), isolated from a sulfate-reducing bacteria. Over the decades, a systematic chemistry of TTM has been well documented. The stability, redox chemistry and metal ions binding affinity of TTM are highly influenced by several factors, including solvent, pH, counter cations, H-bonding, reductant, and oxidant. Therefore, prior to use the TTM as an anti-copper drug on patients with WD/cancer, all physicochemical parameters of TTM should be considered for understanding the efficacy and toxicity. This review sheds light on chemical and physical properties of TTM and the nature of Cu-TTM complexes in biological conditions in order to understand the fate of TTM as well as Cu-TTM complex in vivo.

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对四硫钼酸盐阴离子药物的理化性质进行综述,对治疗四硫钼酸盐治疗的疾病有一定的参考价值
四硫钼酸盐阴离子(MoS42−;TTM是一种很有前途的抗铜药物,特别是对铜超载疾病如Wilson病(WD)和多种癌症的治疗。除药物外,当从硫酸盐还原菌中分离的橙色蛋白(ORP)中发现异金属辅助因子[Cu(TTM)2]3-时,对Cu-TTM相互作用的兴趣扩大了。几十年来,TTM的系统化学已经被很好地记录下来。溶剂、pH、反阳离子、氢键、还原剂和氧化剂等因素对TTM的稳定性、氧化还原化学性质和金属离子结合亲和力有很大影响。因此,在将TTM作为WD/癌症患者的抗铜药物使用之前,应考虑TTM的所有理化参数,以了解其疗效和毒性。本文综述了TTM的化学和物理性质以及Cu-TTM配合物在生物条件下的性质,以了解TTM和Cu-TTM配合物在体内的命运。
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来源期刊
CiteScore
3.50
自引率
7.70%
发文量
492
审稿时长
3-8 weeks
期刊介绍: The Journal of the Indian Chemical Society publishes original, fundamental, theorical, experimental research work of highest quality in all areas of chemistry, biochemistry, medicinal chemistry, electrochemistry, agrochemistry, chemical engineering and technology, food chemistry, environmental chemistry, etc.
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