Study on the Effect of BCl 3 Gas in Ti/Al/Ti Dry Etching Process
With the development of display technology, the thickness required for Ti/Al/Ti materials is becoming thicker and the wiring is becoming narrower. At present, the conventional design in LTPS display technology is to use inorganic films on Ti/Al/Ti material substrates. In the new design of flexible OLED display technology, Ti/Al/Ti substrates gradually use organic films (polyimide, etc.), and the challenges faced by Ti/Al/Ti dry etching process are becoming increasingly significant. This article mainly studies the effect of BCl3 gas on the morphology of Ti/Al/Ti side profile and the etching rate of photoresist in conventional Ti/Al/Ti dry etching process. The experimental results show that as the BCl3 gas flow rate increases, the thickness of Ti/Al/Ti side protective film becomes thinner and the etching rate of PR adhesive decreases. The research results of this article facilitate a better response to the new process of Ti/Al/Ti dry etching of organic films as substrates.
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