T. Matsumae, Hitoshi Umezawa, Y. Kurashima, H. Takagi
{"title":"半導体デバイス基板と高熱伝導率材料の直接接合技術について","authors":"T. Matsumae, Hitoshi Umezawa, Y. Kurashima, H. Takagi","doi":"10.5104/jiep.26.441","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Japan Institute of Electronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5104/jiep.26.441","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
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