{"title":"投稿論文査読・校閲のお礼","authors":"","doi":"10.5104/jiep.26.676","DOIUrl":"https://doi.org/10.5104/jiep.26.676","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"17 1-3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135161108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"耐熱性を有するSn-Sb系高融点はんだ部品内蔵基板の実用化検討","authors":"Mitsuaki Toda","doi":"10.5104/jiep.26.650","DOIUrl":"https://doi.org/10.5104/jiep.26.650","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"294 1-2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135215868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The Device-Embedded Substrate Technology to Implement Heterogeneous Integration","authors":"Henry H. Utsunomiya","doi":"10.5104/jiep.26.634","DOIUrl":"https://doi.org/10.5104/jiep.26.634","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135162061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Component-Embedded Substrates for High-Speed, Large-Scale System Modules","authors":"Shinichi Maeda","doi":"10.5104/jiep.26.644","DOIUrl":"https://doi.org/10.5104/jiep.26.644","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135217022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Baseball, Music, and Technology Conference","authors":"Takaaki Ishigure","doi":"10.5104/jiep.26.p7","DOIUrl":"https://doi.org/10.5104/jiep.26.p7","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"3 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135162053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Contents (in English)","authors":"","doi":"10.5104/jiep.26.c72","DOIUrl":"https://doi.org/10.5104/jiep.26.c72","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"55 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135162070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"目次","authors":"","doi":"10.5104/jiep.26.c71","DOIUrl":"https://doi.org/10.5104/jiep.26.c71","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"22 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135216070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ミッションフェローの広場","authors":"","doi":"10.5104/jiep.26.685","DOIUrl":"https://doi.org/10.5104/jiep.26.685","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135216222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Merging of Additive Electronics and Low Temperature SMT into a Seamless System","authors":"Ryojiro Tominaga","doi":"10.5104/jiep.26.657","DOIUrl":"https://doi.org/10.5104/jiep.26.657","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"31 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135161088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"投稿規定","authors":"","doi":"10.5104/jiep.26.i71","DOIUrl":"https://doi.org/10.5104/jiep.26.i71","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"55 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135162074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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