Identification of printed circuit boards mechanical properties using response surface methods

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2021-12-03 DOI:10.1108/mi-09-2021-0085
Mohammad A. Gharaibeh
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Abstract

Purpose This study aims to discuss the determination of the unknown in-plane mechanical material properties of printed circuit boards (PCBs) by correlating the results from dynamic testing and finite element (FE) models using the response surface method (RSM). Design/methodology/approach The first 10 resonant frequencies and vibratory mode shapes are measured using modal analysis with hammer testing experiment, and hence, systematically compared with finite element analysis (FEA) results. The RSM is consequently used to minimize the cumulative error between dynamic testing and FEA results by continuously modifying the FE model, to acquire material properties of PCBs. Findings Great agreement is shown when comparing FEA to measurements, the optimum in-plane material properties were identified, and hence, verified. Originality/value This paper used FEA and RSMs along with modal measurements to obtain in-plane material properties of PCBs. The methodology presented here can be easily generalized and repeated for different board designs and configurations.
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用响应面法识别印刷电路板的机械性能
目的本研究旨在讨论通过使用响应面法(RSM)将动态测试结果与有限元(FE)模型相关联来确定印刷电路板(PCB)的未知平面内机械材料特性。设计/方法/方法使用模态分析和锤击测试来测量前10个谐振频率和振型实验,并因此与有限元分析(FEA)结果进行了系统的比较。因此,通过不断修改有限元模型,RSM被用于最大限度地减少动态测试和有限元分析结果之间的累积误差,以获得PCB的材料特性。发现当将有限元分析与测量结果进行比较时,显示出极大的一致性,从而确定并验证了最佳平面内材料特性。独创性/价值本文使用有限元分析和RSM以及模态测量来获得PCB的平面内材料特性。这里提出的方法可以很容易地推广和重复不同的板设计和配置。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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